參數(shù)資料
型號(hào): PowerPC 740
廠商: IBM Microeletronics
英文描述: 32-Bit Embedded Microprocessor(32位精簡(jiǎn)指令集嵌入式微處理器)
中文描述: 32位嵌入式微處理器(32位精簡(jiǎn)指令集嵌入式微處理器)
文件頁(yè)數(shù): 24/48頁(yè)
文件大?。?/td> 608K
代理商: POWERPC 740
Page 24
Version 1.02
12/8/99
PowerPC 740 and PowerPC 750 Microprocessor
CMOS 0.20
μ
m Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2
PowerPC 740 Microprocessor Pin Assignments
The following sections contain the pinout diagrams for the PowerPC 740, a 255 pin ceramic ball grid array
(BGA) package.
Figure 13 (in part A) shows the pinout of the PPC 740, a 255 pin Ceramic Ball Grid Array (CBGA) package as
viewed from the top surface. Part B shows the side profile.
Figure 13. Pinout of the PowerPC 740 BGA Package as Viewed from the Top Surface
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16
Not to Scale
Substrate Assembly.
Encapsulation
View
Part B
Die
Part A
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