參數(shù)資料
型號: pentium processor
廠商: Intel Corp.
英文描述: 32 Bit Processor With MMX And Mobile Module(32位帶移動模塊和MMX技術(shù)CPU)
中文描述: 32位處理器MMX和移動模塊(32位帶移動模塊和MMX公司技術(shù)的CPU)
文件頁數(shù): 32/35頁
文件大?。?/td> 550K
代理商: PENTIUM PROCESSOR
INTEL PENTIUM PROCESSOR WITH MMX TECHNOLOGY MOBILE MODULE
E
32
9/19/97 1:03 PM SPEIDEN_.DOC
MMO_009
Figure 9. Standoff Holes, Board Edge Clearance and EMI Containment Ring
The board edge clearance includes a 0.762 mm
(0.030 in) width EMI containment ring around the
perimeter of the module. This ring is on each layer
of the module PCB and is grounded. On the
surface of the module, the metal is exposed for
EMI shielding purposes. The hole patterns placed
on the module also have a plated surrounding ring
and one can use a metal standoff to contact the
ring for EMI shielding purposes. Figure 9 shows
the dimensions of the EMI containment ring and
the keepout area. No components are placed on
the board in the keepout area.
4.3.
Requirements
Module Mounting
Three mounting holes are available to the System
OEM for securing the module to the system base
or the system electronics. See figure 6 for relative
hole placements. It is strongly recommended the
System OEM utilize mounting screws through all
three of these holes to ensure long term reliability
of the mechanical and EMI integrity of the system.
To interface to the module’s thermal transfer plate
(TTP), it is recommended that the exact
dimensions shown in figure 10 for the OEM
thermal interface block be used. These
dimensions provide maximum contact area to the
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