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參數(shù)資料
| 型號： | pentium processor |
| 廠商： | Intel Corp. |
| 英文描述： | 32 Bit Processor With MMX And Mobile Module(32位帶移動模塊和MMX技術(shù)CPU) |
| 中文描述： | 32位處理器MMX和移動模塊（32位帶移動模塊和MMX公司技術(shù)的CPU） |
| 文件頁數(shù)： | 27/35頁 |
| 文件大?。?/td> | 550K |
| 代理商： | PENTIUM PROCESSOR |
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E
INTEL PENTIUM PROCESSOR WITH MMX TECHNOLOGY MOBILE MODULE
27
9/19/97 1:03 PM SPEIDEN_.DOC
Table 14. LM75 SMBUS Address Table
Function
Fixed Address AD Bits (6:3) Selectable Address AD Bits (2:0)
LM75 Thermal Sensor
1001
000
Reserved
1001
001
Reserved
1001
010
NOTES:
The LM75 is not compliant with SMBus addressing. The 4-bit fixed address used by the LM75 is currently invalid under
Revision 1.0 of the System Management Bus Specification from Intel.
After consulting your local Intel sales representative, refer to the datasheet for the LM75 digital thermometer for complete
device programming details.
3.6.
Thermal Transfer Plate
The Intel Mobile Module provides a thermal
transfer plate connected to the processor in a
standard position called the thermal attach point.
The thermal attach point is a fixed location relative
to the mounting holes and other physical datum on
the Intel Mobile Module. The system manufacturer
can use both a heat pipe and a heat spreader plate
in contact with the thermal attach point to transfer
heat through the notebook system.
The thermal transfer plate is physically mounted to
the Intel Mobile Module, and may be different from
one generation of Intel Mobile Module to the next.
However, the thermal attach point will remain fixed
across future generations of Intel Mobile Modules.
Figure 5
between the circuit board, thermal transfer plate
and thermal attach point. Refer to the Intel Mobile
Module Design Guide(Order Number 243339) for
complete mechanical details of the thermal transfer
plate and thermal attach point.
shows
the
conceptual
relationship
3.7.
Module Thermal Resistance
Intel has completed extensive thermal testing of
the module in a variety of environments to
determine the overall thermal resistance between
the CPU TCP packaging and the top of the TTP.
The worst case thermal resistance guaranteed by
Intel is 2.5° C/W though typically this resistance
will be less. System OEMs should take this under
consideration when designing system thermal
solutions.
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