參數(shù)資料
型號(hào)： pentium processor
廠商： Intel Corp.
英文描述： 32 Bit Processor With MMX And Mobile Module(32位帶移動(dòng)模塊和MMX技術(shù)CPU)
中文描述： 32位處理器MMX和移動(dòng)模塊（32位帶移動(dòng)模塊和MMX公司技術(shù)的CPU）
文件頁(yè)數(shù)： 3/35頁(yè)
文件大?。?/td> 550K
代理商： PENTIUM PROCESSOR
E
INTEL PENTIUM PROCESSOR WITH MMX TECHNOLOGY MOBILE MODULE
3
9/19/97 1:03 PM SPEIDEN_.DOC
CONTENTS
PAGE
PAGE
1.0. INTRODUCTION.............................4
1.1. A
RCHITECTURE
O
VERVIEW
...............4
1.2. I
NTEL
M
OBILE
M
ODULE
R
EVISION
I
DENTIFICATION
......................................5
2.0. MODULE CONNECTOR
INTERFACE...........................................6
2.1. S
IGNAL
D
EFINITIONS
.........................6
2.1.1. MEMORY (108 SIGNALS).......7
2.1.2. PCI (56 SIGNALS)....................8
2.1.3. PROCESSOR/PIIX4 ISA
BRIDGE SIDEBAND (9 SIGNALS)...9
2.1.4. POWER MANAGEMENT (9
SIGNALS)........................................11
2.1.5. CLOCK (8 SIGNALS).............12
2.1.6. VOLTAGES (36 SIGNALS)....13
2.1.7. ITP/JTAG (7 SIGNALS) .........14
2.1.8. MISCELLANEOUS (49
SIGNALS)........................................15
2.2. C
ONNECTOR
P
IN
A
SSIGNMENTS
.......16
2.3. C
ONNECTOR
F
OOTPRINT
.................18
2.3.1. PIN AND PAD ASSIGNMENT18
2.4. C
ONNECTOR
S
PECIFICATIONS
..........19
3.0. FUNCTIONAL DESCRIPTION....20
3.1. I
NTEL
M
OBILE
M
ODULE
..................20
3.2. L2 C
ACHE
......................................20
3.3. 430TX PCI
SET
S
YSTEM
C
ONTROLLER
20
3.3.1. MEMORY ORGANIZATION. 20
3.3.2. 64-MBIT SDRAM SUPPORT. 21
3.3.3. PCI INTERFACE.................... 23
3.4. P
ROCESSOR
C
ORE
V
OLTAGE
R
EGULATION
......................................... 23
3.4.1. VOLTAGE REGULATOR
EFFICIENCY................................... 23
3.4.2. VOLTAGE REGULATOR
CONTROL........................................ 24
3.4.3. VOLTAGE SIGNAL
DEFINITION AND SEQUENCING. 25
Voltage Plane Sequencing................. 26
3.5. A
CTIVE
T
HERMAL
F
EEDBACK
.......... 26
3.6. T
HERMAL
T
RANSFER
P
LATE
............ 27
3.7. M
ODULE
T
HERMAL
R
ESISTANCE
..... 27
4.0. MECHANICAL REQUIREMENTS28
4.1. M
ODULE
D
IMENSIONS
.................... 28
4.1.1. BOARD AREA....................... 28
4.1.2. PRINTED CIRCUIT BOARD
THICKNESS..................................... 30
4.1.3. HEIGHT RESTRICTIONS...... 30
4.2. M
ODULE
P
HYSICAL
S
UPPORT
.......... 31
4.3. M
ODULE
M
OUNTING
R
EQUIREMENTS
32
5.0. ENVIRONMENTAL STANDARDS34
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