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| 型號(hào)： | PCA9665 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Fm+ parallel bus to I2C-bus controller |
| 中文描述： | 調(diào)頻并行總線I2C總線控制器 |
| 文件頁(yè)數(shù)： | 85/91頁(yè) |
| 文件大?。?/td> | 372K |
| 代理商： | PCA9665 |
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PCA9665_2
NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 02 — 7 December 2006
85 of 91
NXP Semiconductors
PCA9665
Fm+ parallel bus to I
2
C-bus controller
17.3.2
Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
–
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
–
smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
°
angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250
°
C
or 265
°
C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
17.3.3
Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300
°
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270
°
C and 320
°
C.
17.4 Package related soldering information
Table 56.
Mounting
Suitability of IC packages for wave, reflow and dipping soldering methods
Package
[1]
Soldering method
Wave
suitable
suitable
[3]
not suitable
Reflow
[2]
not suitable
Dipping
suitable
Through-hole mount
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
[4]
Through-hole-surface
mount
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| PCA9665N | Fm+ parallel bus to I2C-bus controller |
| PCA9671 | Remote 16-bit I/O expander for Fm+ I2C-bus with reset |
| PCA9671DB | Remote 16-bit I/O expander for Fm+ I2C-bus with reset |
| PCA9671DK | Remote 16-bit I/O expander for Fm+ I2C-bus with reset |
| PCA9673 | Remote 16-bit I/O expander for Fm+ I2C-bus with interrupt and reset |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCA9665APW,118 | 功能描述:I2C 接口集成電路 Fm+ parallel bus I2C bus controller RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16 |
| PCA9665BS,118 | 功能描述:I2C 接口集成電路 FM+ I2C BUS CONTRLLR RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16 |
| PCA9665BS-T | 功能描述:I2C 接口集成電路 FM+ I2C BUS CONTRLLR RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16 |
| PCA9665D | 功能描述:I2C 接口集成電路 FM+ I2C BUS CONTRLLR RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16 |
| PCA9665D,112 | 功能描述:I2C 接口集成電路 FM+ I2C BUS CONTRLLR RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16 |
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