參數(shù)資料
型號: PCA9665
廠商: NXP Semiconductors N.V.
英文描述: Fm+ parallel bus to I2C-bus controller
中文描述: 調(diào)頻并行總線I2C總線控制器
文件頁數(shù): 84/91頁
文件大小: 372K
代理商: PCA9665
PCA9665_2
NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 02 — 7 December 2006
84 of 91
NXP Semiconductors
PCA9665
Fm+ parallel bus to I
2
C-bus controller
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 54
and
55
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 49
.
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”
Table 54.
Package thickness (mm)
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
350
220
220
< 2.5
2.5
Table 55.
Package thickness (mm)
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
MSL: Moisture Sensitivity Level
Fig 49. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
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