參數(shù)資料
型號: PC7410
廠商: Atmel Corp.
英文描述: PowerPC 7410 RISC Microprocessor Product Specification
中文描述: 7410的PowerPC RISC微處理器產(chǎn)品規(guī)格
文件頁數(shù): 30/54頁
文件大小: 692K
代理商: PC7410
30
PC7410
2141D–HIREL–02/04
Preparation for
Delivery
Handling
MOS devices must be handled with certain precautions to avoid damage due to accu-
mulation of static charge. Input protection devices have been designed in the chip to
minimize the effect of static buildup. However, the following handling practices are
recommended:
Devices should be handled on benches with conductive and grounded surfaces.
Ground test equipment, tools and operator.
Do not handle devices by the leads.
Store devices in conductive foam or carriers.
Avoid use of plastic, rubber or silk in MOS areas.
Maintain relative humidity above 50% if practical.
For CI-CGA packages, use specific tray to take care of the highest height of the
package compared with the normal CBGA.
Package Mechanical Data
Parameters
The package parameters are as provided in the following list. The package type is
25x25 mm, 360-lead CBGA, HiTCE and CI-CGA.
The following remarks apply to Figure 26 and Figure 27:
Dimensions and tolerancing are as per ASME Y14.5M-1994.
All dimensions are in millimeters.
Top side A1 corner index is a metallized feature with various shapes. Bottom side
A1 corner is designated with a ball missing from the array.
Dimension B is the maximum solder ball diameter measured parallel to datum A.
D2 and E2 define the area occupied by the die and underfill. Actual size of this area
may be smaller than shown. D3 and E3 are the minimum clearance from the
package edge to the chip capacitors.
Table 15.
Package Parameters
Parameter
Package outline
25 mm x 25 mm
Interconnects
360 (19 x 19 ball array minus one)
Pitch
1.27 mm (50 mil)
Minimum module height
2.65 mm (CBGA, HiTCE), 3.65 mm (CI-CGA)
Maximum module height
3.20 mm (CBGA), 3.24 mm (HiTCE), 4.20 mm (CI-CGA)
Ball or column diameter
0.89 mm (35 mil)
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