參數(shù)資料
型號(hào)： PC7410
廠商： Atmel Corp.
英文描述： PowerPC 7410 RISC Microprocessor Product Specification
中文描述： 7410的PowerPC RISC微處理器產(chǎn)品規(guī)格
文件頁(yè)數(shù)： 13/54頁(yè)
文件大小： 692K
代理商： PC7410
13
PC7410
2141D–HIREL–02/04
Internal Package Conduction
Resistance
Figure 4 depicts the primary heat transfer path for a package with an attached heat sink
mounted on a printed circuit board.
Heat generated on the active side of the chip is conducted through the silicon, then
through the heat sink attach material (or thermal interface material) and finally to the
heat sink where it is removed by forced-air convection.
Since the silicon thermal resistance is quite small, for a first-order analysis the tempera-
ture drop in the silicon may be neglected. Thus, the heat sink attach material and the
heat sink conduction/convective thermal resistances are the dominant terms.
Figure 4.
C4 Package with Heat Sink Mounted on a Printed Circuit Board
Thermal Management
Information
This section provides thermal management information for the ceramic ball grid array
(CBGA) package for air-cooled applications. Proper thermal control design is primarily
dependent upon the system-level design – the heat sink, airflow and thermal interface
material. To reduce the die-junction temperature, heat sinks may be attached to the
package by several methods: adhesive, spring clip to holes in the printed-circuit board
or package and mounting clip and screw assembly; see Figure 5. This spring force
should not exceed 5.5 pounds of force. Ultimately, the final selection of an appropriate
heat sink depends on many factors such as thermal performance at a given air velocity,
spatial volume, mass, attachment method, assembly and cost.
Figure 5.
CBGA Package Cross-section with Heat Sink Options
External Resistance
External Resistance
Internal Resistance
Radiation
Convection
Heat Sink
Thermal Interface Material
Die/Package
Die Junction
Package/Leads
Printed Circuit Board
Radiation
Convection
Printed-Circuit Board
Adhesive or
Thermal Interface Material
Heat Sink Clip
Heat Sink
Option
相關(guān)PDF資料
PDF描述
PC7410MGHU400L PowerPC 7410 RISC Microprocessor Product Specification
PC7410VGU450N PowerPC 7410 RISC Microprocessor Product Specification
PC7410VGU500L PowerPC 7410 RISC Microprocessor Product Specification
PC7410VGU500N PowerPC 7410 RISC Microprocessor Product Specification
PC7410MGU450L PowerPC 7410 RISC Microprocessor Product Specification
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PC7410M16 制造商:未知廠家 制造商全稱:未知廠家 功能描述:PC7410M16 [Updated 12/02. 35 Pages]
PC7410MG400LE 制造商:e2v technologies 功能描述:MPU 7410 RISC 64BIT 0.18UM 400MHZ 1.8V/2.5V/3.3V 360CBGA - Trays
PC7410MG400NE 制造商:e2v technologies 功能描述:MPU 7410 RISC 64BIT 0.18UM 400MHZ 1.8V/2.5V/3.3V 360CBGA - Trays
PC7410MG450LE 制造商:e2v technologies 功能描述:MPU 7410 RISC 64BIT 0.18UM 450MHZ 1.8V/2.5V/3.3V 360CBGA - Trays
PC7410MG450NE 制造商:e2v technologies 功能描述:MPU 7410 RISC 64BIT 0.18UM 450MHZ 1.8V/2.5V/3.3V 360CBGA - Trays
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