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參數(shù)資料
| 型號(hào)： | DSP56301VF100 |
| 廠商： | Freescale Semiconductor |
| 文件頁(yè)數(shù)： | 6/124頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC DSP 24BIT FIXED-POINT 252-BGA |
| 產(chǎn)品變化通告： | DSP56301 Discontinuation 12/Nov/2009 |
| 標(biāo)準(zhǔn)包裝： | 60 |
| 系列： | DSP563xx |
| 類型： | 定點(diǎn) |
| 接口： | 主機(jī)接口，SSI，SCI |
| 時(shí)鐘速率： | 100MHz |
| 非易失內(nèi)存： | ROM（9 kB） |
| 芯片上RAM： | 24kB |
| 電壓 - 輸入/輸出： | 3.30V |
| 電壓 - 核心： | 3.30V |
| 工作溫度： | -40°C ~ 100°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 252-BGA |
| 供應(yīng)商設(shè)備封裝： | 252-MAPBGA（21x21） |
| 包裝： | 托盤 |
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DSP56301 Technical Data, Rev. 10
Freescale Semiconductor
4-1
Design Considerations
4
4.1 Thermal Design Considerations
An estimate of the chip junction temperature, TJ, in °C can be obtained from this equation:
Equation 1:
Where:
TA
=
ambient temperature °C
RθJA
=
package junction-to-ambient thermal resistance °C/W
PD
=
power dissipation in package
Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and a case-
to-ambient thermal resistance, as in this equation:
Equation 2:
Where:
RθJA
=
package junction-to-ambient thermal resistance °C/W
RθJC
=
package junction-to-case thermal resistance °C/W
RθCA
=
package case-to-ambient thermal resistance °C/W
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to change
the case-to-ambient thermal resistance, RθCA. For example, the user can change the air flow around the device, add
a heat sink, change the mounting arrangement on the printed circuit board (PCB) or otherwise change the thermal
dissipation capability of the area surrounding the device on a PCB. This model is most useful for ceramic packages
with heat sinks; some 90 percent of the heat flow is dissipated through the case to the heat sink and out to the
ambient environment. For ceramic packages, in situations where the heat flow is split between a path to the case
and an alternate path through the PCB, analysis of the device thermal performance may need the additional
modeling capability of a system-level thermal simulation tool.
The thermal performance of plastic packages is more dependent on the temperature of the PCB to which the
package is mounted. Again, if the estimates obtained from RθJA do not satisfactorily answer whether the thermal
performance is adequate, a system-level model may be appropriate.
A complicating factor is the existence of three common ways to determine the junction-to-case thermal resistance
in plastic packages.
To minimize temperature variation across the surface, the thermal resistance is measured from the junction
to the outside surface of the package (case) closest to the chip mounting area when that surface has a
proper heat sink.
To define a value approximately equal to a junction-to-board thermal resistance, the thermal resistance is
measured from the junction to the point at which the leads attach to the case.
T
J
T
A
P
D
RθJA
×
()
+
=
RθJA
RθJC RθCA
+
=
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| DSP56301VF80 | 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC MAP DSP RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT |
| DSP56301VF80B1 | 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC DSP56301VF80B1 RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT |
| DSP56301VL100 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:24-Bit Digital Signal Processor |
| DSP56301VL80 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:24-Bit Digital Signal Processor |
| DSP56302 | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:DSP56301 Digital Signal Processor |
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