參數(shù)資料
型號(hào)： BXM80526B700
廠商： INTEL CORP
元件分類： 微控制器/微處理器
英文描述： 64-BIT, 700 MHz, MICROPROCESSOR, CPGA495
封裝： MICRO, PGA2-495
文件頁(yè)數(shù)： 61/85頁(yè)
文件大?。?/td> 795K
代理商： BXM80526B700
Mobile Intel Pentium III Processor in BGA2 and Micro-PGA2 Packages
at 850 MHz, 800 MHz, 750 MHz, 700 MHz, and Low-voltage 600 MHz
Datasheet
Order#-XXX
56
Table 33. Power Specifications for Mobile Pentium III Processor with Intel SpeedStep Technology
Symbol
Parameter
Min
Typ
1
Max
Unit
Notes
TDP
Thermal Design Power
at 500 MHz & 1.10V
at 550 MHz & 1.35V
at 600 MHz & 1.35V
at 650 MHz & 1.35V
at 700 MHz & 1.35V
at 700 MHz & 1.60V
at 750 MHz & 1.60V
at 800 MHz & 1.60V
at 850 MHz & 1.60V
—
8.1
13.2
14.4
15.1
16.1
23.0
24.6
25.9
27.5
W
at 100°C, Notes 2, 3
PSGNT
Stop Grant and Auto Halt power
at 1.10V (for 500 MHz)
at 1.35V (for 550 MHz, 600 MHz)
at 1.35V (for 650 MHz, 700 MHz)
at 1.60V (for 700 MHz, 750 MHz)
at 1.60V (for 800 MHz, 850 MHz)
—
0.8
1.1
1.6
1.7
2.7
W
at 50°C, Note 3
PQS
Quick Start and Sleep power
at 1.10V (for 500 MHz)
at 1.35V (for 550 MHz, 600 MHz)
at 1.35V (for 650 MHz, 700 MHz)
at 1.60V (for 700 MHz, 750 MHz)
at 1.60V (for 800 MHz, 850 MHz)
—
0.6
0.8
1.2
1.3
1.9
W
at 50°C, Note 3
PDSLP
Deep Sleep power
at 1.10V (for 500 MHz)
at 1.35V (for 550 MHz, 600 MHz)
at 1.35V (for 650 MHz, 700 MHz)
at 1.60V (for 700 MHz, 750 MHz)
at 1.60V (for 800 MHz, 850 MHz)
—
0.2
0.3
0.4
0.5
0.75
W
at 35°C, Note 3
TJ
Junction Temperature
0
100
°C
Note 4
NOTES:
1.
TDPTYP is a recommendation based on the power dissipation of the processor while executing publicly available software
under normal operating conditions at nominal voltages. Contact your Intel Field Sales Representative for further
information.
2.
TDPMAX is a specification of the total power dissipation of the processor while executing a worst-case instruction mix under
normal operating conditions at nominal voltages. It includes the power dissipated by all of the components within the
processor. Not 100% tested. Specified by design/characterization.
3.
Not 100% tested or guaranteed. The power specifications are composed of the current of the processor on the various
voltage planes. These currents are measured and specified at high temperature in Table 9. These power specifications
are determined by characterization of the processor currents at higher temperatures.
4.
TJ is measured with the on-die thermal diode.
6.1 Thermal Diode
The mobile Pentium III processor has an on-die thermal diode that can be used to monitor the die
temperature(TJ). A thermal sensor located on the motherboard, or a stand-alone measurement kit,
may monitor the die temperature of the processor for thermal management or instrumentation
purposes. Table 34 and Table 35 provide the diode interface and specifications.
Note: The reading of the thermal sensor connected to the thermal diode will not necessarily reflect
the temperature of the hottest location on the die. This is due to inaccuracies in the thermal sensor,
on-die temperature gradients between the location of the thermal diode and the hottest location on
the die, and time based variations in the die temperature measurement. Time based variations can
occur when the sampling rate of the thermal diode (by the thermal sensor) is slower than the rate at
which the TJ temperature can change.
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