- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄298893 > BXM80526B700 (INTEL CORP) 64-BIT, 700 MHz, MICROPROCESSOR, CPGA495 PDF資料下載
參數(shù)資料
| 型號： | BXM80526B700 |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, 700 MHz, MICROPROCESSOR, CPGA495 |
| 封裝： | MICRO, PGA2-495 |
| 文件頁數(shù)： | 60/85頁 |
| 文件大小： | 795K |
| 代理商： | BXM80526B700 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁當(dāng)前第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁
Mobile Intel Pentium III Processor in BGA2 and Micro-PGA2 Packages
at 850 MHz, 800 MHz, 750 MHz, 700 MHz, and Low-voltage 600 MHz
Order#-XXX
Datasheet
55
6 Thermal Specifications
This chapter provides needed data for designing a thermal solution. The mobile Pentium III
processor is either a surface mount PBGA-B495 package or a socketable PPGA-B495 package
with the back of the processor die exposed and has a specified operational junction temperature
(TJ) limit.
In order to achieve proper cooling of the processor, a thermal solution (e.g., heat spreader, heat
pipe, or other heat transfer system) must make firm contact to the exposed processor die. The
processor die must be clean before the thermal solution is attached or the processor may be
damaged.
Table 33 provides the maximum Thermal Design Power (TDPMAX) dissipation and the minimum
and maximum TJ temperatures for the mobile Pentium III processor. A thermal solution should be
designed to ensure the junction temperature never exceeds these specifications. If no closed loop
thermal failsafe mechanism (processor throttling) is present to maintain TJ within specification
then the thermal solution should be designed to cool the TDPMAX condition. If a thermal failsafe
mechanism is present then thermal solution could possibly be designed to a typical Thermal
Design Power (TDPTYP). TDPTYP is a thermal design power recommendation based on the power
dissipation of the processor while executing publicly available software under normal operating
conditions at nominal voltages. TDPTYP power is lower than TDPMAX. Contact your Intel Field
Sales Representative for further information.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| BXM80536GC2100F | 32-BIT, 2100 MHz, MICROPROCESSOR, CPGA478 |
| BXM80536GC1800F | 32-BIT, 1800 MHz, MICROPROCESSOR, CPGA478 |
| BXM80536GC1600F | 32-BIT, 1600 MHz, MICROPROCESSOR, CPGA478 |
| BYP60K4 | 60 A, 400 V, SILICON, RECTIFIER DIODE |
| BYS10-45TR3 | 1.5 A, 45 V, SILICON, RECTIFIER DIODE |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BXM80536NC1400ES L7LS | 制造商:Intel 功能描述:CELERON M,360,1.40GHZ,1M CACHE, 400MHZ FSB,1.26V,UFCPGA - Boxed Product (Development Kits) |
| BXMP1000 | 制造商:SPECTRUM 制造商全稱:Spectrum Microwave, Inc. 功能描述:RF AMPLIFIER |
| BXMP1001 | 制造商:SPECTRUM 制造商全稱:Spectrum Microwave, Inc. 功能描述:RF AMPLIFIER |
| BXMP1002 | 制造商:SPECTRUM 制造商全稱:Spectrum Microwave, Inc. 功能描述:RF AMPLIFIER |
| BXMP1003 | 制造商:SPECTRUM 制造商全稱:Spectrum Microwave, Inc. 功能描述:RF AMPLIFIER |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。