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參數(shù)資料
| 型號： | BX80557E2140 |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | MICROPROCESSOR, PBGA775 |
| 封裝： | LGA-775 |
| 文件頁數(shù)： | 80/107頁 |
| 文件大小： | 1474K |
| 代理商： | BX80557E2140 |
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Thermal Specifications and Design Considerations
74
Datasheet
The case temperature is defined at the geometric top center of the processor. Analysis
indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
Table 26 instead of the maximum processor power consumption. The Thermal Monitor
feature is designed to protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained periods of time. For more details on
the usage of this feature, refer to Section 5.2. To ensure maximum flexibility for future
requirements, systems should be designed to the 775_VR_CONFIG_06 guidelines, even
if a processor with a lower thermal dissipation is currently planned. In all cases the
Thermal Monitor and Thermal Monitor 2 feature must be enabled for the
processor to remain within specification.
Table 26.
Processor Thermal Specifications
Processor
Number
Core
Frequency
(GHz)
Thermal
Design
Power (W)1,2
NOTES:
1. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power
that the processor can dissipate.
2. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the
maximum TC will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table for
the allowed combinations of power and TC.
Extended
HALT
Power (w)3
3. Specification is at 35 °C TC and typical voltage loadline. Specification is ensured by design characterization and not 100% tested.
775_VR_
CONFIG_06
Guidance4
4. 775_VR_CONFIG_06 guidelines provide a design target for meeting future thermal requirements.
Minimum
TC (°C)
Maximum TC
(°C)
Notes
E2200
2.2
65.0
8
775_VR_
CONFIG_06
Guidance
5
5
5. These processors have CPUID = 06FDh.
E2180
2.0
65.0
8
5
E2160
1.8
65.0
8
5
E2140
1.6
65.0
8
5
E2160
1.8
65.0
8
775_VR_
CONFIG_06
Guidance
5
6
6. These processors have CPUID = 06F2h.
E2140
1.6
65.0
8
5
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BX80557E2160 S LA8Z | 制造商:Intel 功能描述: |
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