參數(shù)資料
型號(hào)： BX80557E2140
廠商： INTEL CORP
元件分類： 微控制器/微處理器
英文描述： MICROPROCESSOR, PBGA775
封裝： LGA-775
文件頁(yè)數(shù)： 104/107頁(yè)
文件大小： 1474K
代理商： BX80557E2140
Boxed Processor Specifications
96
Datasheet
7.1.2
Boxed Processor Fan Heatsink Weight
The boxed processor fan heatsink will not weigh more than 550 grams. See Chapter 5
and the appropriate Thermal and Mechanical Design Guidelines (see Section 1.2) for
details on the processor weight and heatsink requirements.
7.1.3
Boxed Processor Retention Mechanism and Heatsink
Attach Clip Assembly
The boxed processor thermal solution requires a heatsink attach clip assembly, to
secure the processor and fan heatsink in the baseboard socket. The boxed processor
will ship with the heatsink attach clip assembly.
7.2
Electrical Requirements
7.2.1
Fan Heatsink Power Supply
The processor's fan heatsink requires a +12 V power supply. A fan power cable will be
shipped with the boxed processor to draw power from a power header on the
baseboard. The power cable connector and pinout are shown in Figure 27. Baseboards
must provide a matched power header to support the boxed processor. Table 34
contains specifications for the input and output signals at the fan heatsink connector.
The fan heatsink outputs a SENSE signal, which is an open- collector output that pulses
at a rate of 2 pulses per fan revolution. A baseboard pull-up resistor provides VOH to
match the system board-mounted fan speed monitor requirements, if applicable. Use of
the SENSE signal is optional. If the SENSE signal is not used, pin 3 of the connector
should be tied to GND.
The fan heatsink receives a PWM signal from the motherboard from the 4th pin of the
connector labeled as CONTROL.
The processor's fan heatsink requires a constant +12 V supplied to pin 2 and does not
support variable voltage control or 3-pin PWM control.
The power header on the baseboard must be positioned to allow the fan heatsink power
cable to reach it. The power header identification and location should be documented in
the platform documentation, or on the system board itself. Figure 28 shows the
location of the fan power connector relative to the processor socket. The baseboard
power header should be positioned within 110 mm [4.33 inches] from the center of the
processor socket.
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