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參數(shù)資料
| 型號(hào)： | BX80557E2140 |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | MICROPROCESSOR, PBGA775 |
| 封裝： | LGA-775 |
| 文件頁數(shù)： | 106/107頁 |
| 文件大?。?/td> | 1474K |
| 代理商： | BX80557E2140 |
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Boxed Processor Specifications
98
Datasheet
7.3
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution used by the
boxed processor.
7.3.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the
processor's temperature specification is also a function of the thermal design of the
entire system, and ultimately the responsibility of the system integrator. The processor
temperature specification is listed in Chapter 5. The boxed processor fan heatsink is
able to keep the processor temperature within the specifications (see Table 26) in
chassis that provide good thermal management. For the boxed processor fan heatsink
to operate properly, it is critical that the airflow provided to the fan heatsink is
unimpeded. Airflow of the fan heatsink is into the center and out of the sides of the fan
heatsink. Airspace is required around the fan to ensure that the airflow through the fan
heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling
airspace clearance for the fan heatsink. The air temperature entering the fan should be
kept below 38 C. Again, meeting the processor's temperature specification is the
responsibility of the system integrator.
Figure 28.
Baseboard Power Header Placement Relative to Processor Socket
Boxed Proc PwrHeaderPlacement
B
C
R110
[4.33]
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參數(shù)描述 |
|---|---|
| BX80557E2160 S LA8Z | 制造商:Intel 功能描述: |
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