- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄298893 > BX80557E2140 (INTEL CORP) MICROPROCESSOR, PBGA775 PDF資料下載
參數(shù)資料
| 型號： | BX80557E2140 |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | MICROPROCESSOR, PBGA775 |
| 封裝： | LGA-775 |
| 文件頁數(shù)： | 35/107頁 |
| 文件大?。?/td> | 1474K |
| 代理商： | BX80557E2140 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁當(dāng)前第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁第101頁第102頁第103頁第104頁第105頁第106頁第107頁
Datasheet
33
Package Mechanical Specifications
3
Package Mechanical
Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FC-LGA6) package that
interfaces with the motherboard via an LGA775 socket. The package consists of a
processor core mounted on a substrate land-carrier. An integrated heat spreader (IHS)
is attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink. Figure 7 shows a sketch of
the processor package components and how they are assembled together. Refer to the
LGA775 Socket Mechanical Design Guide for complete details on the LGA775 socket.
The package components shown in Figure 7 include the following:
Integrated Heat Spreader (IHS)
Thermal Interface Material (TIM)
Processor core (die)
Package substrate
Capacitors
NOTE:
1.
Socket and system board are included for reference and are not part of processor package.
3.1
Package Mechanical Drawing
include dimensions necessary to design a thermal solution for the processor. These
dimensions include:
Package reference with tolerances (total height, length, width, etc.)
IHS parallelism and tilt
Land dimensions
Top-side and back-side component keep-out dimensions
Reference datums
All drawing dimensions are in mm [in].
Guidelines on potential IHS flatness variation with socket load plate actuation and
installation of the cooling solution is available in the processor Thermal and
Mechanical Design Guidelines (see Section 1.2).
Figure 7.
Processor Package Assembly Sketch
System Board
LGA775 Socket
Capacitors
TIM
Core (die)
IHS
Substrate
Processor_Pkg_Assembly_775
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| BXM80526B600128 | 64-BIT, 600 MHz, MICROPROCESSOR, PBGA495 |
| BXM80526B700128 | 64-BIT, 700 MHz, MICROPROCESSOR, CPGA495 |
| BXM80526B700 | 64-BIT, 700 MHz, MICROPROCESSOR, CPGA495 |
| BXM80536GC2100F | 32-BIT, 2100 MHz, MICROPROCESSOR, CPGA478 |
| BXM80536GC1800F | 32-BIT, 1800 MHz, MICROPROCESSOR, CPGA478 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BX80557E2160 S LA8Z | 制造商:Intel 功能描述: |
| BX80557E4400 | 制造商:Intel 功能描述:MPU Core?2 Duo Processor E4400 65nm 2GHz 775-Pin FCLGA6 |
| BX80557E4500 S LA95 | 制造商:Intel 功能描述:MPU Core?2 Duo Processor E4500 65nm 2.2GHz 775-Pin FCLGA6 |
| BX80557E4600 S LA94 | 制造商:Intel 功能描述:MPU Core?2 Duo Processor E4600 65nm 2.4GHz 775-Pin FCLGA6 |
| BX80557E6300 | 制造商:Rochester Electronics LLC 功能描述: 制造商:Intel 功能描述: |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。