參數(shù)資料
型號: BX80557E2140
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: MICROPROCESSOR, PBGA775
封裝: LGA-775
文件頁數(shù): 40/107頁
文件大?。?/td> 1474K
代理商: BX80557E2140
Package Mechanical Specifications
38
Datasheet
3.5
Package Insertion Specifications
The processor can be inserted into and removed from a LGA775 socket 15 times. The
socket should meet the LGA775 requirements detailed in the LGA775 Socket
Mechanical Design Guide.
3.6
Processor Mass Specification
The typical mass of the processor is 21.5 g [0.76 oz]. This mass [weight] includes all
the components that are included in the package.
3.7
Processor Materials
Table 22 lists some of the package components and associated materials.
3.8
Processor Markings
Figure 11 shows the topside markings on the processors. This diagram aids in the
identification of the processor.
Table 22.
Processor Materials
Component
Material
Integrated Heat Spreader (IHS)
Nickel Plated Copper
Substrate
Fiber Reinforced Resin
Substrate Lands
Gold Plated Copper
Figure 11.
Processor Top-Side Markings Example
ATPO
S/N
INTEL
'05 E2160
PENTIUM DUAL-CORE
SLxxx [COO]
1.80GHZ/1M/800/06
[FPO]
M
e4
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