- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄298893 > BX80557E2140 (INTEL CORP) MICROPROCESSOR, PBGA775 PDF資料下載
參數(shù)資料
| 型號： | BX80557E2140 |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | MICROPROCESSOR, PBGA775 |
| 封裝： | LGA-775 |
| 文件頁數(shù)： | 79/107頁 |
| 文件大?。?/td> | 1474K |
| 代理商： | BX80557E2140 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁當(dāng)前第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁第101頁第102頁第103頁第104頁第105頁第106頁第107頁
Datasheet
73
Thermal Specifications and Design Considerations
5
Thermal Specifications and
Design Considerations
5.1
Processor Thermal Specifications
The processor requires a thermal solution to maintain temperatures within the
operating limits as described in Section 5.1.1. Any attempt to operate the processor
outside these operating limits may result in permanent damage to the processor and
potentially other components within the system. As processor technology changes,
thermal management becomes increasingly crucial when building computer systems.
Maintaining the proper thermal environment is key to reliable, long-term system
operation.
A complete thermal solution includes both component and system level thermal
management features. Component level thermal solutions can include active or passive
heatsinks attached to the processor Integrated Heat Spreader (IHS). Typical system
level thermal solutions may consist of system fans combined with ducting and venting.
For more information on designing a component level thermal solution, refer to the
appropriate Thermal and Mechanical Design Guidelines (see Section 1.2).
Note:
The boxed processor will ship with a component thermal solution. Refer to Chapter 7
for details on the boxed processor.
5.1.1
Thermal Specifications
To allow for the optimal operation and long-term reliability of Intel processor-based
systems, the system/processor thermal solution should be designed such that the
processor remains within the minimum and maximum case temperature (TC)
specifications when operating at or below the Thermal Design Power (TDP) value listed
per frequency in Table 26. Thermal solutions not designed to provide this level of
thermal capability may affect the long-term reliability of the processor and system. For
more details on thermal solution design, refer to the appropriate Thermal and
Mechanical Design Guidelines (see Section 1.2).
The processor uses a methodology for managing processor temperatures which is
intended to support acoustic noise reduction through fan speed control. Selection of the
appropriate fan speed is based on the relative temperature data reported by the
processor’s Platform Environment Control Interface (PECI) bus as described in
Section 5.4.1.1. The temperature reported over PECI is always a negative value and
represents a delta below the onset of thermal control circuit (TCC) activation, as
indicated by PROCHOT# (see Section 5.2). Systems that implement fan speed control
must be designed to take these conditions in to account. Systems that do not alter the
fan speed only need to ensure the case temperature meets the thermal profile
specifications.
To determine a processor's case temperature specification based on the thermal profile,
it is necessary to accurately measure processor power dissipation. Intel has developed
a methodology for accurate power measurement that correlates to Intel test
temperature and voltage conditions. Refer to the appropriate Thermal and Mechanical
Design Guidelines (see Section 1.2) and the Processor Power Characterization
Methodology for the details of this methodology.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| BXM80526B600128 | 64-BIT, 600 MHz, MICROPROCESSOR, PBGA495 |
| BXM80526B700128 | 64-BIT, 700 MHz, MICROPROCESSOR, CPGA495 |
| BXM80526B700 | 64-BIT, 700 MHz, MICROPROCESSOR, CPGA495 |
| BXM80536GC2100F | 32-BIT, 2100 MHz, MICROPROCESSOR, CPGA478 |
| BXM80536GC1800F | 32-BIT, 1800 MHz, MICROPROCESSOR, CPGA478 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BX80557E2160 S LA8Z | 制造商:Intel 功能描述: |
| BX80557E4400 | 制造商:Intel 功能描述:MPU Core?2 Duo Processor E4400 65nm 2GHz 775-Pin FCLGA6 |
| BX80557E4500 S LA95 | 制造商:Intel 功能描述:MPU Core?2 Duo Processor E4500 65nm 2.2GHz 775-Pin FCLGA6 |
| BX80557E4600 S LA94 | 制造商:Intel 功能描述:MPU Core?2 Duo Processor E4600 65nm 2.4GHz 775-Pin FCLGA6 |
| BX80557E6300 | 制造商:Rochester Electronics LLC 功能描述: 制造商:Intel 功能描述: |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。