參數(shù)資料
型號(hào)： BX80557E2140
廠商： INTEL CORP
元件分類(lèi)： 微控制器/微處理器
英文描述： MICROPROCESSOR, PBGA775
封裝： LGA-775
文件頁(yè)數(shù)： 102/107頁(yè)
文件大?。?/td> 1474K
代理商： BX80557E2140
Boxed Processor Specifications
94
Datasheet
7.1
Mechanical Specifications
7.1.1
Boxed Processor Cooling Solution Dimensions
This section documents the mechanical specifications of the boxed processor. The
boxed processor will be shipped with an unattached fan heatsink. Figure 23 shows a
mechanical representation of the boxed processor.
Clearance is required around the fan heatsink to ensure unimpeded airflow for proper
cooling. The physical space requirements and dimensions for the boxed processor with
assembled fan heatsink are shown in Figure 24 (Side View), and Figure 25 (Top View).
The airspace requirements for the boxed processor fan heatsink must also be
incorporated into new baseboard and system designs. Airspace requirements are
shown in Figure 29 and Figure 30. Note that some figures have centerlines shown
(marked with alphabetic designations) to clarify relative dimensioning.
Figure 24.
Space Requirements for the Boxed Processor (Side View)
Boxed_Proc_SideView
95.0
[3.74]
10.0
[0.39]
25.0
[0.98]
81.3
[3.2]
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
BX80557E2160 S LA8Z 制造商:Intel 功能描述:
BX80557E4400 制造商:Intel 功能描述:MPU Core?2 Duo Processor E4400 65nm 2GHz 775-Pin FCLGA6
BX80557E4500 S LA95 制造商:Intel 功能描述:MPU Core?2 Duo Processor E4500 65nm 2.2GHz 775-Pin FCLGA6
BX80557E4600 S LA94 制造商:Intel 功能描述:MPU Core?2 Duo Processor E4600 65nm 2.4GHz 775-Pin FCLGA6
BX80557E6300 制造商:Rochester Electronics LLC 功能描述: 制造商:Intel 功能描述:
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