參數(shù)資料
型號： 4565B2
元件分類： 數(shù)字傳輸電路
英文描述： ATM/SONET/SDH SUPPORT CIRCUIT, PBGA909
封裝： PLASTIC, BGA-909
文件頁數(shù)： 27/61頁
文件大?。?/td> 1691K
代理商： 4565B2
Hardware Design Guide, Revision 2
4565B Ultramapper Full Transport Retiming Device
December 17, 2003
622/155 Mbits/s SONET/SDH x DS3/E3/DS2/DS1/E1
Agere Systems Inc.
33
Θ
ΘJMA - Junction to Moving Air Thermal Resistance
ΘJMA is effectively identical to ΘJA but represents performance of a part mounted on a JEDEC four layer board inside a wind
tunnel with forced air convection.
ΘJMA is reported at airflows of 200 LFPM and 500 LFPM (linear feet per minute), which
roughly correspond to 1 m/s and 2.5 m/s (respectively).
ΘJMA is calculated using the following formula:
ΘJMA = (TJ – Tamb) / P
Θ
ΘJC - Junction to Case Thermal Resistance
ΘJC is the thermal resistance from junction to the top of the case. This number is determined by forcing nearly 100% of the
heat generated in the die out the top of the package by lowering the top case temperature. This is done by placing the top
of the package in contact with a copper slug kept at room temperature using a liquid refrigeration unit.
ΘJC is calculated using
the following formula:
ΘJC = (TJ – TC) / P
Θ
ΘJB - Junction to Board Thermal Resistance
ΘJB is the thermal resistance from junction to board. This number is determined by forcing the heat generated in the die out
of the package through the leads or balls by lowering the board temperature and insulating the package top. This is done
using a special fixture, which keeps the board in contact with a water chilled copper slug around the perimeter of the package
while insulating the package top.
ΘJB is calculated using the following formula:
ΘJB = (TJ – TB) / P
Ψ
ΨJT
ΨJT correlates the junction temperature to the case temperature. It is generally used by the customer to infer the junction
temperature while the part is operating in their system. It is not considered a true thermal resistance.
ΨJT is calculated using
the following formula:
ΨJT = (TJ – TC) / P
3.3 Reliability
Product reliability can be calculated as the probability that the product will perform under normal operating conditions for a
set period of time. Factors influencing the reliability of a product cover a range of variables, including design and manufac-
turing. The failure rate of a product is given as the number of units failing per unit time. This failure rate is known as FIT,
which is as follows:
1 FIT = 1 Failure/1x10e9 hours.
Another unit used for failure rate is known as MTBF, which is 1/FIT. Many assumptions are made when calculating the failure
rate for a product, such as the average junction temperature and activation energy. The assumptions made for calculating
FIT and MTBF are shown in Table 3-4:
Table 3-3. Thermal Parameter Values
Parameter
Temperature °C/Watt
ΘJA
12.8
ΘJMA (1 m/s)
9.5
ΘJMA (2.5 m/s)
8
ΘJC
2.5
ΘJB
7.6
ΨJT
1
Table 3-4. Reliability Data
Junction Temperature
FIT (Per 10e9 Device Hours
MTBF
Activation Energy
55 °C
36
2.78e7 hours
.7eV
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