
Spartan-3 FPGA Family: Pinout Descriptions
DS099-4 (v1.6) January 17, 2005
Product Specification
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21
R
To have the DONE pin drive High after successful configu-
ration, click the
Startup options
tab and check the
Drive
Done Pin High
box, as shown in
Figure 7
.
Click
OK
when finished.
Again, right-click on the
Generate Programming File
step
in the Process View. This time, choose
Run
or
Rerun
to
execute the changes.
Package Overview
Table 12
shows the 10 low-cost, space-saving production
package styles for the Spartan-3 family. Each package style
is available as a standard and an environmentally-friendly
lead-free (Pb-free) option. The Pb-free packages include an
extra ‘G’ in the package style name. For example, the stan-
dard "VQ100" package becomes "VQG100" when ordered
as the Pb-free option. The mechanical dimensions of the
standard and Pb-free packages are similar, as shown in the
mechanical drawings provided in
Table 14
.
Not all Spartan-3 densities are available in all packages.
However, for a specific package there is a common footprint
for that supports the various devices available in that pack-
age. See the footprint diagrams that follow.
Figure 7:
Setting to Drive DONE Pin High after Configuration
DS099-4_07_030103
Table 12:
Spartan-3 Family Package Options
Package
VQ100 / VQG100
Leads
100
Type
Maximum
I/O
63
Pitch
(mm)
0.5
Area
(mm)
16 x 16
Height
(mm)
1.20
Very-thin Quad Flat Pack
CP132 / CPG132
TQ144 / TQG144
132
144
Chip-Scale Package
Thin Quad Flat Pack
89
97
0.5
0.5
8 x 8
22 x 22
1.10
1.60
PQ208 / PQG208
FT256 / FTG256
208
256
Quad Flat Pack
Fine-pitch, Thin Ball Grid Array
141
173
0.5
1.0
30.6 x 30.6
17 x 17
4.10
1.55
FG320 / FGG320
FG456 / FGG456
320
456
Fine-pitch Ball Grid Array
Fine-pitch Ball Grid Array
221
333
1.0
1.0
19 x 19
23 x 23
2.00
2.60
FG676 / FGG676
FG900 / FGG900
676
900
Fine-pitch Ball Grid Array
Fine-pitch Ball Grid Array
489
633
1.0
1.0
27 x 27
31 x 31
2.60
2.60
FG1156 / FGG1156
1156
Fine-pitch Ball Grid Array
784
1.0
35 x 35
2.60