參數資料
型號： W25Q80BWZPIP
廠商： WINBOND ELECTRONICS CORP
元件分類： PROM
英文描述： 8M X 1 SPI BUS SERIAL EEPROM, PDSO8
封裝： 6 X 5 MM, GREEN , PLASTIC, WSON-8
文件頁數： 64/71頁
文件大?。?/td> 0K
代理商： W25Q80BWZPIP
W25Q80BW
Publication Release Date: January 26, 2011
- 67 -
Preliminary - Revision A
8-Pad WSON 6x5-mm Cont’d.
SYMBOL
MILLIMETERS
INCHES
Min
Nom
Max
Min
Nom
Max
SOLDER PATTERN
M
3.40
0.134
N
4.30
0.169
P
6.00
0.236
Q
0.50
0.020
R
0.75
0.026
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of
exposed PCB vias under the pad.
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