參數(shù)資料
型號(hào)： W25Q80BWZPIP
廠商： WINBOND ELECTRONICS CORP
元件分類(lèi)： PROM
英文描述： 8M X 1 SPI BUS SERIAL EEPROM, PDSO8
封裝： 6 X 5 MM, GREEN , PLASTIC, WSON-8
文件頁(yè)數(shù)： 62/71頁(yè)
文件大?。?/td> 0K
代理商： W25Q80BWZPIP
W25Q80BW
Publication Release Date: January 26, 2011
- 65 -
Preliminary - Revision A
10.2 8-Pin SOIC 208-mil (Package Code SS)
θ
GAUGE PLANE
θ
GAUGE PLANE
SYMBOL
MILLIMETERS
INCHES
Min
Nom
Max
Min
Nom
Max
A
1.75
1.95
2.16
0.069
0.077
0.085
A1
0.05
0.15
0.25
0.002
0.006
0.010
A2
1.70
1.80
1.91
0.067
0.071
0.075
b
0.35
0.42
0.48
0.014
0.017
0.019
C
0.19
0.20
0.25
0.007
0.008
0.010
D
5.18
5.28
5.38
0.204
0.208
0.212
D1
5.13
5.23
5.33
0.202
0.206
0.210
E
5.18
5.28
5.38
0.204
0.208
0.212
E1
5.13
5.23
5.33
0.202
0.206
0.210
e
(2)
1.27 BSC.
0.050 BSC.
H
7.70
7.90
8.10
0.303
0.311
0.319
L
0.50
0.65
0.80
0.020
0.026
0.031
y
---
0.10
---
0.004
θ
0°
---
8°
0°
---
8°
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
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