參數(shù)資料
型號(hào): W25Q80BWZPIP
廠商: WINBOND ELECTRONICS CORP
元件分類: PROM
英文描述: 8M X 1 SPI BUS SERIAL EEPROM, PDSO8
封裝: 6 X 5 MM, GREEN , PLASTIC, WSON-8
文件頁(yè)數(shù): 49/71頁(yè)
文件大?。?/td> 0K
代理商: W25Q80BWZPIP
W25Q80BW
Publication Release Date: January 26, 2011
- 53 -
Preliminary - Revision A
8.2.35 Read JEDEC ID (9Fh)
For compatibility reasons, the W25Q80BW provides several instructions to electronically determine the
identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC standard for SPI
compatible serial memories that was adopted in 2003. The instruction is initiated by driving the /CS pin
low and shifting the instruction code “9Fh”. The JEDEC assigned Manufacturer ID byte for Winbond (EFh)
and two Device ID bytes, Memory Type (ID15-ID8) and Capacity (ID7-ID0) are then shifted out on the
falling edge of CLK with most significant bit (MSB) first as shown in figure 33. For memory type and
capacity values refer to Manufacturer and Device Identification table.
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30 31
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30 31
Figure 33. Read JEDEC ID Instruction Sequence
相關(guān)PDF資料
PDF描述
W25Q80VZPI 1M X 8 SPI BUS SERIAL EEPROM, DSO8
W26B041H70LI 256K X 16 STANDARD SRAM, 70 ns, PDSO44
W26B04B-70LE 256K X 16 STANDARD SRAM, 70 ns, PBGA48
W29L102Q-20B 64K X 16 FLASH 3.3V PROM, 200 ns, PDSO40
W33D2011 LIQUID CRYSTAL DISPLAY DRIVER, PQFP64
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W25S243A 制造商:WINBOND 制造商全稱:Winbond 功能描述:64K X 64 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM
W25S243A-12 制造商:WINBOND 制造商全稱:Winbond 功能描述:64K X 64 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM
W25S243AD-12 制造商:WINBOND 制造商全稱:Winbond 功能描述:64K X 64 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM
W25S243AF-12 制造商:WINBOND 制造商全稱:Winbond 功能描述:64K X 64 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM
W25X10 制造商:WINBOND 制造商全稱:Winbond 功能描述:The W25X10 (1M-bit), W25X20 (2M-bit), W25X40 (4M-bit) and W25X80 (8M-bit) Serial Flash memories provide a storage solution for systems with limited space, pins and power.