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參數(shù)資料
| 型號： | TDA8035HN/C1 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 模擬信號調理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, PQCC32 |
| 封裝： | 5 X 5 MM, 0.85 MM HEIGHT, PLASTIC, SOT617-7, HVQFN-32 |
| 文件頁數(shù)： | 9/32頁 |
| 文件大小： | 908K |
| 代理商： | TDA8035HN/C1 |
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TDA8035HN
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1.0 — 19 April 2011
17 of 32
NXP Semiconductors
TDA8035HN
Smart card interface
9.
Limiting values
All card contacts are protected against any short with any other card contact.
Stress beyond these levels may cause permanent damage to the device. This is a stress
rating only and functional operation of the device under this condition is not implied.
10. Thermal characteristics
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDDP
power supply voltage
0.3
6
V
VDD(INTF)
interface supply voltage
0.3
4.1
V
VIH
High-level input voltage CS, PRESN,
CMDVCCN, CLKDIV2,
CLKDIV1, EN_1.8VN,
EN_5V/3VN, RSTIN,
OFFN, PORADJ, XTAL1,
I/OUC, AUX1UC, AUX2UC,
VDDP, VDD(INTF)
0.3
4.1
V
I/O, RST, AUX1, AUX2 and
CLK
0.35.75V
Tamb
ambient temperature
25
+85
°C
Tstg
storage temperature
55
+150
°C
Tj
junction temperature
+125
°C
Ptot
total power dissipation
Tamb = 40 to +85 °C0.45
W
VESD
electrostatic discharge
voltage
Human Body Model (HBM)
on card pins I/O, RST, VCC,
AUX1, CLK, AUX2, PRESN
within typical application
10
+10
kV
Human Body Model (HBM)
on all other pins
2+2
kV
Machine Model (MM) on
all pins
200
+200
V
Field Charged Device
Model (FCDM) on all pins
500
+500
V
Table 6.
Thermal characteristics
Symbol
Package name Parameter
Conditions
Typ
Unit
Rth(j-a)
HVQFN32
thermal resistance from junction
to ambient
in free air with 4 thermal vias
on pcb
55
K/W
in free air without thermal
vias on pcb
63
K/W
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