參數(shù)資料
型號: TDA8035HN/C1
廠商: NXP SEMICONDUCTORS
元件分類: 模擬信號調理
英文描述: SPECIALTY ANALOG CIRCUIT, PQCC32
封裝: 5 X 5 MM, 0.85 MM HEIGHT, PLASTIC, SOT617-7, HVQFN-32
文件頁數(shù): 29/32頁
文件大?。?/td> 908K
代理商: TDA8035HN/C1
TDA8035HN
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1.0 — 19 April 2011
6 of 32
NXP Semiconductors
TDA8035HN
Smart card interface
SBM
17
VDDP
I/O
DC/DC converter capacitor ; connected between SBM and SBP; C =
330nF with ESR < 100m
Ω
VDDP
18
VDDP
supply
Power supply voltage
SBP
19
VDDP
I/O
DC/DC converter capacitor ; connected between SBM and SBP; C =
330nF with ESR < 100m
Ω
SAP
20
VDDP
I/O
DC/DC converter capacitor ; connected between SAM and SAP; C =
330nF with ESR < 100m
Ω
VUP
21
VDDP
I/O
DC/DC converter output decoupling capacitor connected between
VUP and GNDP; C = 1uF with ESR < 100m
Ω
Vcc
22
Vcc
O
supply for the card (C1)( decouple to GND with 2
× 220nF capacitors
with ESR < 100m
Ω).
RST
23
Vcc
O
card reset (C2)
CLK
24
Vcc
O
clock to the card (C3)
GNDC
25
-
supply
card signal ground
AUX1
26
Vcc
I/O
auxiliary data line to/from the card (C4)(internal 10 k pull up resistor to
Vcc )
AUX2
27
Vcc
I/O
auxiliary data line to/from the card (C8)(internal 10 k pull up resistor to
Vcc )
I/O
28
Vcc
I/O
data line to/from the card (C7)(internal 10 k pull up resistor to
Vcc)
CS
29
VDD(INTF)
I
Chip Select input from the host ( active High )
PRESN
30
VDD(INTF)
I
card presence contact input (active LOW); if PRESN is true, then the
card is considered as present. A debouncing feature of 4.05 ms typ.
is built in.
AUX1UC
31
VDD(INTF)
I/O
auxiliary data line to/from the host (internal 10 k pull up resistor to
VDD(INTF) )
AUX2UC
32
VDD(INTF)
I/O
auxiliary data line to/from the host (internal 10 k pull up resistor to
VDD(INTF) )
Table 3.
Pin description …continued
Symbol
Pin
Supply
Type
Description
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