參數(shù)資料
型號(hào)： TDA8035HN/C1
廠商： NXP SEMICONDUCTORS
元件分類： 模擬信號(hào)調(diào)理
英文描述： SPECIALTY ANALOG CIRCUIT, PQCC32
封裝： 5 X 5 MM, 0.85 MM HEIGHT, PLASTIC, SOT617-7, HVQFN-32
文件頁(yè)數(shù)： 20/32頁(yè)
文件大?。?/td> 908K
代理商： TDA8035HN/C1
TDA8035HN
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1.0 — 19 April 2011
27 of 32
NXP Semiconductors
TDA8035HN
Smart card interface
Typical dwell time is 4 seconds at 250
°C. A mildly-activated flux will eliminate the need
for removal of corrosive residues in most applications.
14.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300
°C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°C.
14.5 Package related soldering information
[1]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods.
[2]
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and
heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
[3]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[4]
Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than
0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[5]
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
15. Abbreviations
Table 8.
Suitability of surface mount IC packages for wave and reflow soldering methods
Package
Soldering method
Wave
Reflow[1]
BGA, HBGA, LFBGA, SQFP, TFBGA
not suitable
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, SMS
not suitable[2]
suitable
PLCC[3], SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended[3][4]
suitable
SSOP, TSSOP, VSO
not recommended[5]
suitable
Table 9.
Abbreviations
Acronym
Description
ESD
ElectroStatic Discharge
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