參數(shù)資料
型號: SAA6721E
廠商: NXP SEMICONDUCTORS
元件分類: 圖形處理器
英文描述: SXGA RGB to TFT graphics engine(XGA RGB 到 TFT圖形引擎)
中文描述: GRAPHICS PROCESSOR, PBGA292
封裝: 27 X 27 MM, 1.75 MM HEIGHT, PLASTIC, SOT-489-1, BGA-292
文件頁數(shù): 2/72頁
文件大?。?/td> 360K
代理商: SAA6721E
1999 May 11
2
Philips Semiconductors
Preliminary specification
SXGA RGB to TFT graphics engine
SAA6721E
CONTENTS
1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
2
3
4
5
6
7
7.1
7.2
7.2.1
7.2.2
7.2.3
7.2.4
7.2.5
7.3
7.4
7.5
7.5.1
7.5.2
7.6
7.6.1
7.6.2
7.7
7.8
7.8.1
7.8.2
7.8.3
7.9
7.9.1
7.9.2
8
8.1
8.2
8.2.1
8.2.2
8.3
8.3.1
8.3.2
8.3.3
8.3.4
8.3.5
FEATURES
RGB video input
YUV video input
Video processing
On screen display
Video output
Memory interface
Miscellaneous
GENERAL DESCRIPTION
QUICK REFERENCE DATA
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING INFORMATION
FUNCTIONAL DESCRIPTION
Data path
System clocks
Input interface clock (VCLK)
Memory interface clock (MCLKI)
I
2
C-bus interface clock (SCL)
System clock (CLK)
TFT panel clock (PCLK)
RGB input port
YUV input port
TFT output port
Single pixel mode
Double pixel mode
Memory port
SDRAM memory configuration
SGRAM memory configuration
I
2
C-bus interface
De-interlacing algorithms
Static mesh mode
Spatial filtering
Temporal filtering
Scaling algorithm
Upscaling
Downscaling
SYSTEM DESCRIPTION
Programming registers
Clock management
Clock generation and multiplexing
Clock divider
RGB/YUV input interface
Sampling mode
RGB data sampling
Clamp pulse generation
Gain correction pulse generation
YUV data sampling
8.4
Video mode and synchronization signal
detection
Memory interface and de-interlacer unit
Memory interface limitations
Initialization of external memory
Frame and field memory
Frame recovery
Scaling
Downscaling
Upscaling
Upscaler transition function
Panning unit
Overlay port
Overlay insertion
Sync generation
Data sampling
OVCLK gating
Colour space matrix
Colour correction
On screen display
OSD generals
OSD window
OSD character matrix
Temporal dithering (frame rate controller)
Output interface
General
Frame generation
Timing reference signals
LIMITING VALUES
CHARACTERISTICS
TIMING CHARACTERISTICS
APPLICATION INFORMATION
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DEFINITIONS
LIFE SUPPORT APPLICATIONS
PURCHASE OF PHILIPS I
2
C COMPONENTS
8.5
8.5.1
8.5.2
8.5.3
8.5.4
8.6
8.6.1
8.6.2
8.6.3
8.7
8.8
8.8.1
8.8.2
8.8.3
8.8.4
8.9
8.10
8.11
8.11.1
8.11.2
8.11.3
8.12
8.13
8.13.1
8.13.2
8.13.3
9
10
11
12
13
14
14.1
14.2
14.3
14.4
14.5
15
16
17
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