參數資料
型號: S71WS512N80BFIZZ0
廠商: Spansion Inc.
英文描述: Stacked Multi-Chip Product (MCP) Flash Memory and pSRAM CMOS 1.8 Volt
中文描述: 堆疊式多芯片產品(MCP)的閃存和移動存儲芯片的CMOS 1.8伏特
文件頁數: 109/142頁
文件大?。?/td> 1996K
代理商: S71WS512N80BFIZZ0
June 28, 2004 S71WS512NE0BFWZZ_00_A1
128Mb pSRAM
109
P r e l i m i n a r y
DC CHARACTERISTICS
(Under Recommended Operating Conditions unless otherwise noted)
Note *1,*2,*3
Notes
*1: All voltages are referenced to Vss.
*2: DC Characteristics are measured after following POWER-UP timing.
*3: I
OUT
depends on the output load conditions.
Parameter
Symbol
Test Conditions
Min.
Max.
Unit
Input Leakage Current
I
LI
V
IN
= V
SS
to V
DDQ
-1.0
+1.0
μ
A
Output Leakage Current
I
LO
V
OUT
= V
SS
to V
DDQ
, Output Disable
-1.0
+1.0
μ
A
Output High Voltage Level
V
OH
V
DDQ
= V
DDQ
(min), I
OH
= –0.5mA
1.4
V
Output Low Voltage Level
V
OL
I
OL
= 1mA
0.4
V
V
DD
Power Down
Current
I
DDPS
V
DD
= V
DD
max.,
V
DDQ
= V
DDQ
max.,
V
IN
= V
IH
or V
IL
,
CE2
0.2V
SLEEP
10
μ
A
I
DDP16
16M Partial
120
μ
A
I
DDP32
32M Partial
150
μ
A
V
DD
Standby
Current
I
DDS
V
DD
= V
DD
max., V
DDQ
= V
DDQ
max.,
V
IN
(including CLK)= V
IH
or V
IL
,
CE#1 = CE2 = V
IH
1.5
mA
I
DDS1
V
DD
= V
DD
max., V
DDQ
= V
DDQ
max.,
V
IN
(including CLK)
0.2V or
V
IN
(including CLK)
V
DDQ
– 0.2V,
CE#1 = CE2
V
DDQ
– 0.2V
300
μ
A
I
DDS2
V
DD
= V
DD
max., V
DDQ
= V
DDQ
max.,
tCK=min.
V
IN
0.2V or V
IN
V
DDQ
– 0.2V,
CE#1 = CE2
V
DDQ
– 0.2V
350
μ
A
V
DD
Active Current
I
DDA1
V
DD
= V
DD
max.,
V
DDQ
= V
DDQ
max.,
V
IN
= V
IH
or V
IL
,
CE#1 = V
IL
and CE2= V
IH
,
I
OUT
=0mA
t
RC
/ t
WC
=
minimum
35
mA
I
DDA2
t
RC
/ t
WC
=
1
μ
s
5
mA
V
DD
Page Read Current
I
DDA3
V
DD
= V
DD
max., V
DDQ
= V
DDQ
max.,
V
IN
= V
IH
or V
IL
, CE#1 = V
IL
and CE2= V
IH
,
I
OUT
=0mA, t
PRC
= min.
15
mA
V
DD
Burst Access Current
I
DDA4
V
DD
= V
DD
max., V
DDQ
= V
DDQ
max.,
V
IN
= V
IH
or V
IL
, CE#1 = V
IL
and CE2= V
IH
,
t
CK
= t
CK
min., BL = Continuous,
I
OUT
=0mA,
30
mA
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