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參數(shù)資料
| 型號(hào)： | PPC440EP |
| 廠商： | Applied Micro Circuits Corp. |
| 英文描述： | Power PC 440EP Embedded Processor |
| 中文描述： | 440EP的Power PC嵌入式處理器 |
| 文件頁(yè)數(shù)： | 62/84頁(yè) |
| 文件大小： | 541K |
| 代理商： | PPC440EP |
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62
AMCC Proprietary
440EP – PPC440EP Embedded Processor
Revision 1.26 – April 25, 2007
Data Sheet
Thermal Management
The following heat sinks were used in the above thermal analysis:
ALPHA W35-15W (35mm x 35mm x15mm)
ALPHA LPD35-15B (35mm x 35mm x15mm)
Table 12. DC Power Supply Current Loads
Parameter
Symbol
Typical
Maximum
Unit
Notes
V
DD
(1.5V) active operating current
I
DD
1380
2200
mA
OV
DD
(3.3V) active operating current
I
ODD
10
100
mA
SV
DD
(2.5V) active operating current
I
SDD
460
600
mA
AV
DD
(1.5V) input current
I
ADD
3.2
5
mA
1
SAV
DD
(1.5V) active operating current
I
SADD
6.05
10
mA
1
Notes:
1. See “Absolute Maximum Ratings” on page 59 for filter recommendations.
2. The maximum current values listed above are not guaranteed to be the highest obtainable. These values are dependent on many factors
including the type of applications running, clock rates, use of internal functional capabilities, external interface usage, case temperature,
and the power supply voltages. Your specific application can produce significantly different results. V
DD
current and power are primarily
dependent on the applications running and the use of internal chip functions (DMA, PCI, Ethernet, and so on). OV
DD
current and power
are primarily dependent on the capacitive loading, frequency, and utilization of the external buses.
3. Typical current is estimated at 667MHz with V
DD
= +1.5V, OV
DD
= +3.3V, SV
DD
= +2.5V, and
T
C
= +85°C, while running Linux and a test
application that exercises each core with representative traffic.
4. Maximum current is estimated at 667MHz with V
DD
= +1.6V, OV
DD
= +3.6V, SV
DD
= +2.7V,
T
C
= +85°C, and a best-case process (which
drives worst-case power), while running Linux and a test application that exercises each core with representative traffic.
Table 13. Package Thermal Specifications
Thermal resistance values for the E-PBGA and TE-PBGA package are as follows:
Parameter
Symbol
Package
Airflow
ft/min (m/sec)
Unit
Notes
0 (0)
100 (0.51)
200 (1.02)
Junction-to-ambient thermal resistance
without heat sink
θ
JA
E-PBGA
20.0
18.7
17.9
°C/W
Junction-to-ambient thermal resistance
with heat sink
θ
JA
E-PBGA
15.3
11.9
10.5
°C/W
Resistance Value
Junction-to-case thermal resistance
θ
JC
E-PBGA
8.3
°C/W
Junction-to-board thermal resistance
θ
JB
E-PBGA
14.3
°C/W
Notes:
1. Case temperature, T
C
, is measured at top center of case surface with device soldered to circuit board.
2. T
A
= T
C
- P
×θ
CA
, where T
A
is ambient temperature and P is power consumption.
3. T
CMax
=
T
JMax
- P
×θ
JC
, where T
JMax
is maximum junction temperature (+125°C) and P is power consumption.
4. The preceding equations assume that the chip is mounted on a board with at least one signal and two power planes.
5. Values in the table were achieved with a JEDEC standard board: 114.5mm x 101.6mm x 1.6mm, 4 layers.
6. Values for an attached heat sink were achieved with a 35mm x 35mm x 15mm unit (see Thermal Management below), attached with a
0.1mm thickness of adhesive having a thermal conductivity of 1.3W/mK.
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