參數(shù)資料
型號: PowerPC 750
廠商: IBM Microeletronics
英文描述: 32-Bit Embedded Microprocessor(32位精簡指令集嵌入式微處理器)
中文描述: 32位嵌入式微處理器(32位精簡指令集嵌入式微處理器)
文件頁數(shù): 27/46頁
文件大?。?/td> 610K
代理商: POWERPC 750
9/30/99
Version 2.0
Datasheet
Page 23
PowerPC 750 SCM RISC Microprocessor
Preliminary Copy
PID8p-750
PowerPC PID8p-750 Microprocessor Pin Assignments
The following sections contain the pinout diagrams for the PID8p-750 SCM. IBM offers a ceramic ball grid
array 360 CBGA packages.
Figure 13 (in part A) shows the pinout of the 360 CBGA package as viewed from the top surface. Part B
shows the side profile of the 360 CBGA package to indicate the direction of the top surface view.
Figure 13. Pinout of the 360 CBGA Package as Viewed from the Top Surface
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16
Not to Scale
Substrate Assembly.
Encapsulation
View
Part B
Die
Part A
17 18 19
U
V
W
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