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參數(shù)資料
| 型號： | PowerPC 750 |
| 廠商： | IBM Microeletronics |
| 英文描述： | 32-Bit Embedded Microprocessor(32位精簡指令集嵌入式微處理器) |
| 中文描述： | 32位嵌入式微處理器（32位精簡指令集嵌入式微處理器） |
| 文件頁數(shù)： | 11/46頁 |
| 文件大小： | 610K |
| 代理商： | POWERPC 750 |
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9/30/99
Version 2.0
Datasheet
Page 7
PowerPC 750 SCM RISC Microprocessor
Preliminary Copy
PID8p-750
The following table provides the package thermal characteristics for the PID8p-750.
The PID8p-750 incorporates a thermal management assist unit (TAU) composed of a thermal sensor, digital-
to-analog converter, comparator, control logic, and dedicated special-purpose registers (SPRs). See the 750
RISC Microprocessor User’s Manual for more information on the use of this feature. Specifications for the
thermal sensor portion of the TAU are found in the table below.
L2 bus supply voltage, pin A19 tied to HRESET
L2OV
DD(2.5V)
2.375 to 2.625
V
L2 bus supply voltage, pin A19 tied to GND
L2OV
DD(1.8V)
1.71 to 1.89
V
Input voltage (under AC conditions, inputs must go rail to
rail for maximum AC timing performance)
V
IN(60X)
GND to OV
DD
V
V
IN(L2)
GND to L2OV
DD
V
Die-junction temperature
T
J
0 to 105
°
C
Package Thermal Characteristics
Characteristic
Symbol
Value
Unit
CBGA package thermal resistance, junction-to-case ther-
mal resistance (typical)
θ
JC
0.03
°
C/W
CBGA package thermal resistance, junction-to-lead ther-
mal resistance (typical)
θ
JB
3.8
°
C/W
Note:
Refer to Section “Thermal Management Information,” on page 34 for more information about thermal management.
Thermal Sensor Specifications
See Table “Recommended Operating Conditions1,2,3,” on page 6, for operating conditions.
Num
Characteristic
Minimum
Maximum
Unit
Notes
1
Temperature range
0
128
°
C
1
2
Comparator settling time
20
—
ms
2
3
Resolution
4
—
°
C
3
Note:
1. The temperature is the junction temperature of the die. The thermal assist unit's (TAU) raw output does not indicate an absolute temperature, but it
must be interpreted by software to derive the absolute junction temperature. For information on how to use and calibrate the TAU, contact your local
IBM sales office. This specification reflects the temperature span supported by the design.
2. The comparator settling time value must be converted into the number of CPU clocks that need to be written into the THRM3 SPR.
3. This value is guaranteed by design and is not tested.
Recommended Operating Conditions
1,2,3
Characteristic
Symbol
Value
Unit
Note:
1. These are recommended and tested operating conditions. Proper device operation outside of these conditions is not guaranteed.
2. For dd3.x, If W1 is left unconnected, the 60X bus will default to OV
DD
= 3.3V. For dd2x, W1=Don’t care
3. For dd3.x, If A19 is left unconnected, the L2 bus will default to L2OV
DD
= 3.3V. For dd2x, W1=Don’t care
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