參數(shù)資料
型號： Pentium OverDrive Processor
廠商： Intel Corp.
英文描述： Pentium OverDrive Processor With MMX Technology For Pentium Processor-Based System(帶MMX技術(shù)奔騰超速轉(zhuǎn)動處理器)
中文描述： 奔騰過驅(qū)動處理器的MMX技術(shù)的Pentium處理器為基礎(chǔ)的系統(tǒng)（帶MMX公司技術(shù)奔騰超速轉(zhuǎn)動處理器）
文件頁數(shù)： 52/61頁
文件大?。?/td> 481K
代理商： PENTIUM OVERDRIVE PROCESSOR
Pentium
OverDrive
PROCESSOR WITH MMX
TECHNOLOGY
E
52
9/8/97 11:55 AM 29060701.DOC
PRELIMINARY
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01.65
REF.
D
L
SEATING PLANE
REF.
2.29
1.52
Pin C3
E2
D
D1
A1
A2
A4
A
A5
heat sink
fan
air space
B
E1
PP0077
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290607-14
Figure 14. Pentium OverDrive Processor with MMX Technology Package Dimensions
6.2.
Spatial Requirements
The Pentium OverDrive processor with MMX
technology
employs
a
management device. Clearance requirements must
be met around the fan/heatsink to ensure unimpeded air
flow for proper cooling. Figure 15 shows the Pentium
OverDrive
processor
with
fan/heatsink space requirements.
fan/heatsink
thermal
MMX
technology’s
The Pentium OverDrive processor with MMX
technology has spatial requirements defined in the
respective socket specification that must be met. As
shown in Figure 16, it is acceptable to allow any
device (i.e., add-in cards, surface mount device,
chassis, etc.) to enter within the free space distance
of 0.2” from the Pentium OverDrive processor with
MMX technology package if it is not taller than the
level of the heatsink base. In other words, if a
component is taller than height “B,” it cannot be
closer to the Pentium OverDrive processor with MMX
technology package than distance “A”. This applies
to three of the four sides of the Pentium OverDrive
processor with MMX technology package, although
the back and handle sides of a ZIF socket will
generally automatically meet this specification since
they have widths larger than distance “A.”
Compliance to this requirement will ensure systems
can be upgraded to the Pentium OverDrive
processor with MMX technology.
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