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| 型號(hào)： | PCA9665N |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類(lèi)： | 總線控制器 |
| 英文描述： | Fm+ parallel bus to I2C-bus controller |
| 中文描述： | I2C BUS CONTROLLER, PDIP20 |
| 封裝： | 0.300 INCH, PLASTIC, MS-001, SOT146-1, DIP-20 |
| 文件頁(yè)數(shù)： | 86/91頁(yè) |
| 文件大?。?/td> | 372K |
| 代理商： | PCA9665N |
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PCA9665_2
NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 02 — 7 December 2006
86 of 91
NXP Semiconductors
PCA9665
Fm+ parallel bus to I
2
C-bus controller
[1]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note(AN01026); order a copy from your NXP
Semiconductors sales office.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with
respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of
the moisture in them (the so called popcorn effect).
[3]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
[4]
Hot bar soldering or manual soldering is suitable for PMFP packages.
[5]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed
through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217
°
C
±
10
°
C
measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible.
[6]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate
between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the
[7]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction. The package footprint
must incorporate solder thieves downstream and at the side corners.
[8]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for
packages with a pitch (e) equal to or smaller than 0.65 mm.
[9]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely
not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[10] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil.
However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate
soldering profile can be provided on request.
Surface mount
BGA, HTSSON..T
[5]
, LBGA,
LFBGA,SQFP,SSOP..T
[5]
,TFBGA,
VFBGA, XSON
DHVQFN, HBCC, HBGA, HLQFP,
HSO, HSOP, HSQFP, HSSON,
HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
[7]
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L
[10]
, WQCCN..L
[10]
not suitable
suitable
not suitable
[6]
suitable
suitable
not recommended
[7][8]
not recommended
[9]
not suitable
suitable
suitable
suitable
not suitable
Table 56.
Mounting
Suitability of IC packages for wave, reflow and dipping soldering methods
…continued
Package
[1]
Soldering method
Wave
Reflow
[2]
Dipping
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCA9665N,112 | 功能描述:I2C 接口集成電路 FM+ I2C BUS CONTRLLR RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16 |
| PCA9665PW | 制造商:NXP Semiconductors 功能描述:IC CNTRLR PARALLEL I2C 20TS 制造商:UNBRANDED 功能描述:UNIVERSAL BUS FUNCTIONS FM+12C BUS *NIC* 制造商:NXP Semiconductors 功能描述:IC, CNTRLR PARALLEL, I2C, 20TSSOP 制造商:NXP Semiconductors 功能描述:IC, CNTRLR PARALLEL, I2C, 20TSSOP; Interface Type:I2C, Parallel, SMBus; Interface Applications:I2C Bus & SMBus Systems Applications; Supply Voltage Min:2.3V; Supply Voltage Max:3.6V; Digital IC Case Style:TSSOP; No. of Pins:20; ;RoHS Compliant: Yes |
| PCA9665PW,112 | 功能描述:I2C 接口集成電路 FM+ I2C BUS CONTRLLR RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16 |
| PCA9665PW,118 | 功能描述:I2C 接口集成電路 FM+ I2C BUS CONTRLLR RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16 |
| PCA9665PW,118-CUT TAPE | 制造商:NXP 功能描述:PCA9635 Series 1 MHz Fm + Parallel Bus to I2C-Bus Controller - TSSOP-20 |
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