參數(shù)資料
型號： MPC604ERX300XX
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： RISC PROCESSOR, CBGA255
封裝： 21 X 21 MM, 3.30 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
文件頁數(shù)： 9/29頁
文件大小： 217K
代理商： MPC604ERX300XX
PRELIMINAR
Y
PID9q-604e Hardware Specifications
17
PRELIMINARYSUBJECT TO CHANGE WITHOUT NOTICE
1.6 Pinout Listings
Table 10 provides the pinout listing for the 604e CBGA package.
Table 10. Pinout Listing for the CBGA Package
Signal Name
Pin Number
Active
I/O
A[031]
C16, E04, D13, F02, D14, G01, D15, E02, D16, D04, E13,
GO2, E15, H01, E16, H02, F13, J01, F14, J02, F15, H03,
F16, F04, G13, K01, G15, K02, H16, M01, J15, P01
High
I/O
AACK
L02
Low
Input
ABB
K04
Low
I/O
AP[03]
C01, B04, B03, B02
High
I/O
APE
A04
Low
Output
ARRAY_WR 1
B07
Low
Input
ARTRY
J04
Low
I/O
AVDD
A10
BG
L01
Low
Input
BR
B06
Low
Output
CI
E01
Low
Output
CKSTP_IN
D08
Low
Input
CKSTP_OUT
A06
Low
Output
CLK_OUT
D07
Output
CSE[01]
B01, B05
High
Output
DBB
J14
Low
I/O
DBG
N01
Low
Input
DBDIS
H15
Low
Input
DBWO
G04
Low
Input
DH[031]
P14, T16, R15, T15, R13, R12, P11, N11, R11,T12, T11,
R10, P09, N09, T10, R09, T09, P08, N08, R08, T08, N07,
R07, T07, P06, N06, R06, T06, R05, N05, T05, T04
High
I/O
DL[031]
K13, K15, K16, L16, L15, L13, L14, M16, M15, M13, N16,
N15, N13, N14, P16, P15, R16, R14, T14, N10, P13, N12,
T13, P03, N03, N04, R03, T01, T02, P04, T03, R04
High
I/O
DP[07]
M02, L03, N02, L04, R01, P02, M04, R02
High
I/O
DPE
A05
Low
Output
DRTRY
G16
Low
Input
DRVMOD03
D05
High
Input
DRVMOD13
C03
High
Input
GBL
F01
Low
I/O
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