參數(shù)資料
型號： MPC604ERX300XX
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： RISC PROCESSOR, CBGA255
封裝： 21 X 21 MM, 3.30 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
文件頁數(shù)： 20/29頁
文件大小： 217K
代理商： MPC604ERX300XX
PRELIMINAR
Y
PID9q-604e Hardware Specifications
27
PRELIMINARYSUBJECT TO CHANGE WITHOUT NOTICE
Assuming an air velocity of 0.5 m/s, we have an effective Rsa of 5 C/W, thus
Tj = 30 C + 5 C + (0.03 C/W + 1.0 C/W + 5 C/W) * 7.5 W,
resulting in a junction temperature of approximately 81 C which is just below the maximum operating
temperature of the part. To ensure maximum reliability, it is desirable to operate the 604e well within its
operating temperature range. Thus, to keep a 7.5 W 604e within its proper operating range, an air velocity
greater than 0.5 m/s should be used with the Thermalloy #2333B pin-n heat sink.
Other heat sinks offered by Thermalloy, Aavid, Wakeeld, and IERC offer different heat sink-to-ambient
thermal resistances, and may or may not need air ow. It is necessary to perform an analysis as done above
to select the desired heat sink.
Though the junction-to-ambient and the heat sink-to-ambient thermal resistances are commonly used to
compare the thermal performance of various microelectronic packaging technologies, one should exercise
caution when only using this metric in determining thermal management because no single parameter can
adequately describe three-dimensional heat ow. The nal chip-junction operating temperature is not only
a function of the component-level thermal resistance, but the system-level design and its operating
conditions. In addition to the component's power consumption, a number of factors affect the nal operating
die-junction temperature. These factors might include airow, board population (local heat ux of adjacent
components), heat sink efciency, heat sink attach, next-level interconnect technology, system air
temperature rise, etc. Due to the complexity and the many variations of system-level boundary conditions
for today's microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation,
convection and conduction) may vary widely. For these reasons, we recommend using conjugate heat
transfer models for the board as well as system-level designs. To expedite system-level thermal analysis,
several compact thermal-package models are available within FLOTHERM¨. These are available upon
request.
1.9 Ordering Information
This section provides the part numbering nomenclature for the 604e. Note that the individual part numbers
correspond to a specic combination of 604e internal/bus frequencies, which must be observed to ensure
proper operation of the device. For available frequency combinations, contact your local Motorola or IBM
sales ofce.
In addition to the processor frequency and bus ratio, the part numbering scheme also consists of a part
modier. The part modier indicates the enhancement in the part from the original production design. Each
part number also contains a revision code. This refers to the die mask revision number and is specied in
the part numbering scheme for identication purposes only.
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