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參數(shù)資料
| 型號： | MPC604ERX300XX |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | RISC PROCESSOR, CBGA255 |
| 封裝： | 21 X 21 MM, 3.30 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件頁數(shù)： | 17/29頁 |
| 文件大?。?/td> | 217K |
| 代理商： | MPC604ERX300XX |
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PRELIMINAR
Y
24
PID9q-604e Hardware Specifications
PRELIMINARYSUBJECT TO CHANGE WITHOUT NOTICE
1.8.6 Thermal Management Information
This section provides thermal management information for the ceramic ball grid array (CBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent upon the system-level
designthe heat sink, airow and thermal interface material. To reduce the die-junction temperature, heat
sinks may be attached to the package by several methodsadhesive, spring clip to holes in the printed-
circuit board or package, and mounting clip and screw assembly; see Figure 12. This spring force should
not exceed 5.5 pounds of force.
Figure 12. Package Exploded Cross-Sectional View with Several Heat Sink Options
The board designer can choose between several types of heat sinks to place on the 604e. There are several
commercially-available heat sinks for the 604e provided by the following vendors:
Thermalloy
2021 W. Valley View Lane
214-243-4321
P.O. Box 810839
Dallas, TX 75731
International Electronic Research Corporation (IERC)
135 W. Magnolia Blvd.
Burbank, CA 91502
818-842-7277
Aavid Engineering
603-528-3400
One Kool Path
Laconic, NH 03247-0440
Wakeeld Engineering
617-245-5900
60 Audubon Rd.
Wakeeld, MA 01880
Ultimately, the nal selection of an appropriate heat sink for the 604e depends on many factors, such as
thermal performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
Adhesive
or
Thermal Interface Material
Heat Sink
CBGA Package
Heat Sink
Clip
Printed-Circuit Board
Option
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