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參數(shù)資料
| 型號： | MPC604ERX300XX |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | RISC PROCESSOR, CBGA255 |
| 封裝： | 21 X 21 MM, 3.30 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件頁數(shù)： | 19/29頁 |
| 文件大小： | 217K |
| 代理商： | MPC604ERX300XX |
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PRELIMINAR
Y
26
PID9q-604e Hardware Specifications
PRELIMINARYSUBJECT TO CHANGE WITHOUT NOTICE
1.8.6.2 Thermal Management Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
Tj = Ta + Tr + (Rqjc +Ra + Rsa) * Q
Where:
Tj is the die-junction temperature
Ta is the inlet cabinet ambient temperature
Tr is the air temperature rise within the system cabinet
Rqjc is the die-junction-to-top of die thermal resistance of the device
Ra is the thermal resistance of the thermal interface material (thermal grease or thermal compound)
Rsa is the heat sink-to-ambient thermal resistance
Q is the power consumed by the device
Typical die-junction temperatures (Tj) should be maintained less than 105 C. The temperature of the air
cooling the component greatly depends upon the ambient inlet air temperature and the air temperature rise
within the computer cabinet. A computer cabinet inlet-air temperature (Ta) may range from 30 to 40 C. The
air temperature rise within a cabinet (Tr) may be in the range of 5 to 10 C. The thermal resistance of the
interface material (Ra) is typically about 1 C/W. Assuming a Ta of 30 C, a Tr of 5 C, and a power
consumption (Q) of 7.5 watts, the following expression for Tj is obtained:
Junction temperature: Tj = 30 C + 5 C + (0.03 C/W + 1.0 C/W + Rsa) * 7.5 W
For a Thermalloy heat sink #2333B, the heat sink-to-ambient thermal resistance (Rsa) versus airow
velocity is shown in Figure 14.
Figure 14. Thermalloy #2328B Heat Sink-to-Ambient Thermal Resistance Versus Airflow Velocity
1
3
5
7
8
0
0.5
1
1.5
2
2.5
3
3.5
Thermalloy #2328B Pin-fin Heat Sink
Approach Air Velocity (m/s)
Heat
Sink
Thermal
Resistance
(C/W)
(25 x28 x 15 mm)
2
4
6
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