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參數資料
| 型號： | MPC604ERX300XX |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | RISC PROCESSOR, CBGA255 |
| 封裝： | 21 X 21 MM, 3.30 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件頁數： | 11/29頁 |
| 文件大小： | 217K |
| 代理商： | MPC604ERX300XX |
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PRELIMINAR
Y
PID9q-604e Hardware Specifications
19
PRELIMINARYSUBJECT TO CHANGE WITHOUT NOTICE
1.7 Package Description
The package parameters for the 604e are provided in the following list. The package type is 21 mm, 256-
lead ceramic ball grid array (CBGA).
Package outline
21 x 21 mm
Interconnects
255
Pitch
1.27 mm (50 mil)
Maximum module height
3.30 mm
Ball diameter
0.89 mm (35 mil)
WT
D02
Low
Output
VDD
F06, F08, F09, F11, G07, G10, H06, H08, H09, H11, J06,
J08, J09, J11, K07, K10, L06, L08, L09, L11
VOLTDETGND2
F03
XATS
J16
Low
I/O
Notes:
1. These are test signals for factory use only and must be pulled up to Vdd for normal machine operation.
2. NC (no-connect) in the 604; internally tied to GND in the 604e CBGA package to indicate to the power
supply that a low-voltage processor is present.
3. To operate in accordance with these specications, the drive mode signals must be congured with
DRVMOD0 = high, and DRVMOD1 = high.
Table 10. Pinout Listing for the CBGA Package (Continued)
Signal Name
Pin Number
Active
I/O
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