參數(shù)資料
型號: MC13214R2
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: SPECIALTY MICROPROCESSOR CIRCUIT, BGA71
封裝: 9 X 9 MM, 1 MM HEIGHT, ROHS COMPLIANT, LGA-71
文件頁數(shù): 63/70頁
文件大?。?/td> 802K
代理商: MC13214R2
MC13211/212/213/214 Technical Data, Rev. 0.0,
66
Freescale Semiconductor
NOTE
Crystal suppliers frequently specify the crystal package separately form the
desired crystal parameters. Care should be taken that desired crystal
specifications can be obtained in the desired package.
7.2
RF Single Port Application with an F Antenna
Figure 35 shows a typical single port RF application topology in which part count is minimized and a
printed copper F antenna is used for low cost. Only the RFIN port of the MC1321x is required because the
differential port is bi-directional and uses the on-chip T/R switch. Matching to near 50 Ohms is
accomplished with L1, L2, L3, and the traces on the PCB. A balun transforms the differential signal to
single-ended to interface with the F antenna.
The proper DC bias to the RFIN_x (PAO_x) pins is provided through the balun. The CT_Bias pin provides
the proper bias voltage point to the balun depending on operation, that is, CT_Bias is at VDDA voltage for
transmit and is at ground for receive. CT_Bias is switched between these two voltages based on the
operation. Capacitor C2 provides some high frequency bypass to the dc bias point. The L3/C1 network
provides a simple bandpass filter to limit out-of-band harmonics from the transmitter.
NOTE
Passive component values can vary as a function of circuit board layout as
required to obtain best matching and RF performance.
Figure 35. RF Single Port Application with an F-Antenna
7.3
RF Dual Port Application with an F-Antenna
Figure 36 shows a typical dual port application topology which also uses a printed copper F antenna. Both
the RFIN and PAO ports are used and the internal T/R switch is bypassed. Matching is provided for both
differential ports by L5, L6, L7, and L9 and C4 and C7. A balun is used for both receive and transmit paths
which are provided by the external T/R switch, IC1. This implementation, while more complicated, gives
1 With this crystal oscillator frequency trimming is NOT required in production.
2 This crystal recommended for applications that employ Doze mode.
L2
3.9nH
5
1
6
2
3
4
Z1
LDB212G4005C-001
L3
3.9nH
C1
1.0pF
R1
0R
R2
0R
Not Mounted
1
2
5
3
4
J1
SMA_edge_Receptac
C2
10pF
ANT1
F_Antenna
L1
1.5nH
L4
1.5nH
GPIO1
44
PAO_M
39
PAO_P
38
RFIN_P
36
RFIN_M
35
CT_Bias
34
U1
MC1321x
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