參數(shù)資料
型號: IDT88P8344
廠商: Integrated Device Technology, Inc.
英文描述: SPI EXCHANGE 4 x SPI-3 TO SPI-4 Issue 1.0
中文描述: SPI交換4 ×的SPI - 3至SPI - 4期1.0
文件頁數(shù): 94/98頁
文件大?。?/td> 601K
代理商: IDT88P8344
94
IDT88P8344 SPI EXCHANGE 4 x SPI-3 TO SPI-4
INDUSTRIAL TEMPERATURE RANGE
APRIL 10, 2006
12.3 Device package
The SPI Exchange IDT88P8344 device is packaged in a 35 mmby 35 mm
820-ball one mllimeter ball pitch thermally-enhanced plastic ball grid array. All
balls, whether used or unused, must be soldered to pads.
Figure 42. IDT88P8344 820PBGA package, bottom view
相關(guān)PDF資料
PDF描述
IDT88P8344BHGI SPI EXCHANGE 4 x SPI-3 TO SPI-4 Issue 1.0
IDTAMB0480 ADVANCED MEMORY BUFFER FOR FULLY BUFFERED DIMM MODULES
IDTCSP2510DPGI 3.3V PHASE-LOCK LOOP CLOCK DRIVER ZERO DELAY BUFFER
IDTCSP2510DPG SENSOR OPTICAL SLOTTED 1.0MM
IDTCSP2510D 3.3V PHASE-LOCK LOOP CLOCK DRIVER ZERO DELAY BUFFER
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