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| 型號： | IDT88P8344 |
| 廠商： | Integrated Device Technology, Inc. |
| 英文描述： | SPI EXCHANGE 4 x SPI-3 TO SPI-4 Issue 1.0 |
| 中文描述： | SPI交換4 ×的SPI - 3至SPI - 4期1.0 |
| 文件頁數(shù)： | 3/98頁 |
| 文件大?。?/td> | 601K |
| 代理商： | IDT88P8344 |
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IDT88P8344 SPI EXCHANGE 4 x SPI-3 TO SPI-4
INDUSTRIAL TEMPERATURE RANGE
APRIL 10, 2006
Table of Contents (Continued)
9.3 Indirect registers for SPI-3A, SPI-3B, SPI-3C, SPI-3D modules........................................................................................................................56
9.3.1 Block base 0x0000 registers .................................................................................................................................................................57
9.3.2 Block base 0x0200 registers .................................................................................................................................................................57
9.3.3 Block base 0x0500 registers .................................................................................................................................................................58
9.3.4 Block base 0x0700 registers .................................................................................................................................................................59
9.3.5 Block base 0x0A00 registers.................................................................................................................................................................61
9.3.6 Block base 0x0C00 registers.................................................................................................................................................................61
9.3.7 Block base 0x1000 registers .................................................................................................................................................................64
9.3.8 Block base 0x1100 registers..................................................................................................................................................................64
9.3.9 Block base 0x1200 registers .................................................................................................................................................................64
9.3.10 Block base 0x1300 registers ...............................................................................................................................................................65
9.3.11 Block base 0x1600 registers................................................................................................................................................................66
9.3.12 Block base 0x1700 registers ...............................................................................................................................................................66
9.3.13 Block base 0x1800 registers ...............................................................................................................................................................66
9.3.14 Block base 0x1900 registers ...............................................................................................................................................................67
9.4 Common module indirect registers (Module_base 0x8000)...............................................................................................................................68
9.4.1 Common module block base 0x0000 registers.......................................................................................................................................69
9.4.2 Common module block base 0x0100 registers.......................................................................................................................................69
9.4.3 Common module block base 0x0200 registers.......................................................................................................................................69
9.4.4 Common module block base 0x0300 registers.......................................................................................................................................69
9.4.5 Common module block base 0x0400 registers.......................................................................................................................................72
9.4.6 Common module block base 0x0500 registers.......................................................................................................................................72
9.4.7 Common module block base 0x0600 registers.......................................................................................................................................73
9.4.8 Common module block base 0x0700 registers.......................................................................................................................................73
9.4.9 Common module block base 0x0800 registers.......................................................................................................................................75
10. JTAG interface.......................................................................................................................................................................................................79
11. Electrical and Thermal Specifications ................................................................................................................................................................79
11.1 Absolute maximumratings...............................................................................................................................................................................79
11.2 Recommended Operating Conditions..............................................................................................................................................................79
11.3 Termnal Capacitance.....................................................................................................................................................................................80
11.4 Thermal Characteristics..................................................................................................................................................................................80
11.5 DC Electrical characteristics............................................................................................................................................................................81
11.6 AC characteristics...........................................................................................................................................................................................82
11.6.1 SPI-3 I/O timng...................................................................................................................................................................................82
11.6.2 SPI-4 LVDS Input / Output...................................................................................................................................................................83
11.6.3 SPI-4 LVTTL Status AC characteristics.................................................................................................................................................84
11.6.4 REF_CLK clock input..........................................................................................................................................................................84
11.6.5 MCLK internal clock and OCLK[3:0] clock outputs ................................................................................................................................84
11.6.6 Mcroprocessor interface .....................................................................................................................................................................84
11.6.6.1 Mcroprocessor parallel port AC timng specifications..................................................................................................................85
11.6.6.2 Serial mcroprocessor interface (serial peripheral interface mode)..............................................................................................89
12. Mechanical characteristics..................................................................................................................................................................................90
12.1 Device overview...........................................................................................................................................................................................90
12.2 Pin name/ball location table ............................................................................................................................................................................91
12.3 Device package.............................................................................................................................................................................................94
13. Glossary ................................................................................................................................................................................................................96
14. Datasheet Document Revision History..............................................................................................................................................................97
15. Ordering information ...........................................................................................................................................................................................98
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相關(guān)代理商/技術(shù)參數(shù) |
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| IDT88P8344BHGI | 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 類別:集成電路 (IC) >> 專用 IC 系列:* 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:1 系列:- 類型:調(diào)幀器 應用:數(shù)據(jù)傳輸 安裝類型:表面貼裝 封裝/外殼:400-BBGA 供應商設備封裝:400-PBGA（27x27） 包裝:散裝 |
| IDT88P8344BHI | 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 類別:集成電路 (IC) >> 專用 IC 系列:* 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:1 系列:- 類型:調(diào)幀器 應用:數(shù)據(jù)傳輸 安裝類型:表面貼裝 封裝/外殼:400-BBGA 供應商設備封裝:400-PBGA（27x27） 包裝:散裝 |
| IDT89H10T4BG2ZBBC | 制造商:Integrated Device Technology Inc 功能描述:IC PCI SW 10LANE 4PORT 324BGA |
| IDT89H10T4BG2ZBBC8 | 制造商:Integrated Device Technology Inc 功能描述:IC PCI SW 10LANE 4PORT 324BGA |
| IDT89H10T4BG2ZBBCG | 功能描述:IC PCI SW 10LANE 4PORT 324BGA RoHS:是 類別:集成電路 (IC) >> 專用 IC 系列:PRECISE™ 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:1 系列:- 類型:調(diào)幀器 應用:數(shù)據(jù)傳輸 安裝類型:表面貼裝 封裝/外殼:400-BBGA 供應商設備封裝:400-PBGA（27x27） 包裝:散裝 |
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