參數(shù)資料
型號(hào): GS8161EV32BD-200
廠商: GSI TECHNOLOGY
元件分類: SRAM
英文描述: 512K X 32 CACHE SRAM, 6.5 ns, PBGA165
封裝: 13 X 15 MM, 1 MM PITCH, FBGA-165
文件頁數(shù): 25/34頁
文件大?。?/td> 864K
代理商: GS8161EV32BD-200
GS8161EV18B(T/D)/GS8161EV32B(D)/GS8161EV36B(T/D)
Preliminary
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.00 9/2004
31/34
2004, GSI Technology
TQFP Package Drawing (Package T)
D1
D
E1
E
Pin
1
b
e
c
L
L1
A2
A1
Y
θ
Notes:
1. All dimensions are in millimeters (mm).
2. Package width and length do not include mold protrusion.
Symbol
Description
Min. Nom. Max
A1
Standoff
0.05
0.10
0.15
A2
Body Thickness
1.35
1.40
1.45
b
Lead Width
0.20
0.30
0.40
c
Lead Thickness
0.09
0.20
D
Terminal Dimension
21.9
22.0
22.1
D1
Package Body
19.9
20.0
20.1
E
Terminal Dimension
15.9
16.0
16.1
E1
Package Body
13.9
14.0
14.1
e
Lead Pitch
0.65
L
Foot Length
0.45
0.60
0.75
L1
Lead Length
1.00
Y
Coplanarity
0.10
θ
Lead Angle
0
°
7
°
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