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| 型號： | EVAL-ADV739XFEZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 19/108頁 |
| 文件大?。?/td> | 0K |
| 描述： | BOARD EVAL FOR ADV739XFEZ |
| 標(biāo)準包裝： | 1 |
| 系列： | Advantiv® |
| 主要目的： | 視頻，視頻處理 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | ADV7403 |
| 主要屬性： | NTSC/PAL 數(shù)字視頻解碼器 |
| 次要屬性： | 前端板，用于 ADV7390、ADV7391、ADV7392 和 ADV7393 編碼器背端板 |
| 已供物品： | 板 |
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ADV7390/ADV7391/ADV7392/ADV7393
Data Sheet
Rev. G | Page 18 of 108
ABSOLUTE MAXIMUM RATINGS
Table 13.
Parameter1
Rating
VAA to AGND
0.3 V to +3.9 V
VDD to DGND
0.3 V to +2.3 V
PVDD to PGND
0.3 V to +2.3 V
VDD_IO to GND_IO
0.3 V to +3.9 V
AGND to DGND
0.3 V to +0.3 V
AGND to PGND
0.3 V to +0.3 V
AGND to GND_IO
0.3 V to +0.3 V
DGND to PGND
0.3 V to +0.3 V
DGND to GND_IO
0.3 V to +0.3 V
PGND to GND_IO
0.3 V to +0.3 V
Digital Input Voltage to GND_IO
0.3 V to VDD_IO + 0.3 V
Analog Outputs to AGND
0.3 V to VAA
Max CLKIN Input Frequency
80 MHz
Storage Temperature Range (tS)
60°C to +100°C
Junction Temperature (tJ)
150°C
Lead Temperature (Soldering, 10 sec)
260°C
1
Analog output short circuit to any power supply or common can be of an
indefinite duration.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 14. Thermal Resistance1
Package Type
θJA2
θJC-TOP3
θJC-BOTTOM4
Unit
30-Ball WLCSP
35
1
N/A
°C/W
32-Lead LFCSP
27
32
1.2
°C/W
40-Lead LFCSP
26
32
1
°C/W
1
Values are based on a JEDEC 4-layer test board.
2
With the exposed metal paddle on the underside of the LFCSP soldered to
the PCB ground.
3
This is the thermal resistance of the junction to the top of the package.
4
This is the thermal resistance of the junction to the bottom of the package.
The ADV739x is an RoHS-compliant, Pb-free product. The lead
finish is 100% pure Sn electroplate. The device is suitable for Pb-
free applications up to 255°C (±5°C) IR reflow (JEDEC STD-20).
The ADV739x is backward compatible with conventional SnPb
soldering processes. The electroplated Sn coating can be soldered
with SnPb solder pastes at conventional reflow temperatures of
220°C to 235°C.
ESD CAUTION
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