19-4750; Rev 1; 07/11 38 of 194 the Fragment byte depth (e.g. 24 bytes for T1).
參數(shù)資料
型號(hào): DS34S132GN+
廠商: Maxim Integrated Products
文件頁(yè)數(shù): 127/194頁(yè)
文件大?。?/td> 0K
描述: IC TDM OVER PACKET 676-BGA
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 40
功能: TDM-over-Packet(TDMoP)
接口: TDMoP
電路數(shù): 1
電源電壓: 1.8V, 3.3V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 676-BGA
供應(yīng)商設(shè)備封裝: 676-PBGA(27x27)
包裝: 管件
其它名稱: 90-34S13+2N0
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)當(dāng)前第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)第138頁(yè)第139頁(yè)第140頁(yè)第141頁(yè)第142頁(yè)第143頁(yè)第144頁(yè)第145頁(yè)第146頁(yè)第147頁(yè)第148頁(yè)第149頁(yè)第150頁(yè)第151頁(yè)第152頁(yè)第153頁(yè)第154頁(yè)第155頁(yè)第156頁(yè)第157頁(yè)第158頁(yè)第159頁(yè)第160頁(yè)第161頁(yè)第162頁(yè)第163頁(yè)第164頁(yè)第165頁(yè)第166頁(yè)第167頁(yè)第168頁(yè)第169頁(yè)第170頁(yè)第171頁(yè)第172頁(yè)第173頁(yè)第174頁(yè)第175頁(yè)第176頁(yè)第177頁(yè)第178頁(yè)第179頁(yè)第180頁(yè)第181頁(yè)第182頁(yè)第183頁(yè)第184頁(yè)第185頁(yè)第186頁(yè)第187頁(yè)第188頁(yè)第189頁(yè)第190頁(yè)第191頁(yè)第192頁(yè)第193頁(yè)第194頁(yè)
DS34S132 DATA SHEET
19-4750; Rev 1; 07/11
38 of 194
the Fragment byte depth (e.g. 24 bytes for T1). Pn.PRCR1.BFD and Pn.PTCR1.BFD specify how many Fragments
are used by each Staging Buffer (4 Fragments will store data for a 4 x 125 us = 500 us period).
BPF should be set to the number of bytes exchanged on the TDAT/RDAT interface in a 125 us period (e.g. for T1:
17 hex for “24 bytes”; for E1: 1F hex for “32 bytes”). For applications where TDAT and RDAT are used to support a
slower, non-T1/E1 interface, the BPF can be set to any integer value to represent the TDM Port data rate (data
received in a 125 us period; e.g. BPF = 1 for 64 Kb/s).
The BFD setting enables a compromise between the processing latency and the total number of Bundles supported
by an S132. Smaller BFD settings enable a smaller processing latency (smaller wait period to fill the Staging
Buffer), but with a smaller maximum number of Bundles. To function properly, the BFD value must also be set so
that the data stored in the Staging Buffer cannot exceed the smallest Bundle payload size associated with that TDM
Port (i.e. the number of bytes represented by BPF * BFD must be ≤ the number of bytes represented by
B.BCDR1.PMS for all Bundles assigned to that TDM Port). Table 9-3 describes the BFD settings.
Table 9-3. TDM Port BFD Settings
BFD value Staging Buffer Depth
Staging Buffer Latency
Maximum # of Bundles
0
TDM Port data path disabled
-
1
1 Fragment
125 us
64
2
2 Fragment
250 us
128
3
4 Fragment
500 us
256
For CES applications, the BFD and PMS settings can be directly compared since both are essentially specified in
frames (BFD PMS; for CES applications the number of bytes stored by the Staging Buffer Fragment is equal to
the number of bytes in one CES Frame, or 1 Fragment = 1 Frame). As an example, if PMS = 3 (3 frames per
packet payload), then BFD should be set to 10b or 01b (1 or 2 fragments). For SAT applications the PMS setting is
specified in bytes (instead of frames) and the TXP/RXP Bundle packets are programmed to carry a payload size
that is not related to a frame size (“frames” are not applicable to the SAT/Unstructured application). For SAT
applications the following “BFD to PMS” comparison can be used:
BFD (in Fragments) x BPF (in bytes per Fragment) ≤ PMS (in bytes)
In SAT applications, the S132 supports T1/E1 line rates and slower, non-T1/E1 rates. For all SAT applications, the
Pn.PRCR1.SPL register be programmed to indicate how many bytes are included in each RXP/TXP Bundle
payload. The TDM Port SPL value should be set to the same value as the Bundle PMS.
For SAT (Unstructured), non-T1/E1 applications (e.g. V.35), the TDM Port should use a line rate that is
approximately equal to an integer multiple of 64 Kb/s. This might be referred to as an “Unstructured Nx64” signal. In
this document it is called a “non-T1/E1” signal. Unstructured (SAT) signals usually are asynchronous signals. The
term “Nx64” can also refer to a “Structured Nx64” signal that is synchronized to the public network and can be
carried by a T1/E1 for transporting and switching in the public network (e.g. “Fractional T1/E1” and ISDN signals). A
“Structured Nx64” signal is carried by a CES PW (the S132 only supports “Structured Nx64” with T1/E1 line rate
TDM Ports).
For the best latency performance, each TDM Port BFD should be set to the lowest possible value allowed for the
maximum number of Bundles that will be supported by the S132. With a selected BFD value, all Bundle PMS
values associated with that TDM Port cannot be smaller than BFD. As an example, if it is necessary to support a
Bundle with a PMS = 1 (1 frame per packet or one packet every 125 us) then no more than 64 Bundles can be
supported by the S132 (the standards only require a maximum packet rate of one packet every 1 ms).
9.2.4 Timeslot Assignment Block
For T1/E1 applications, the S132 includes a Timeslot Assignment Block with the ability to monitor outgoing CAS
and control outgoing SW CAS Conditioning, Data Conditioning, and Loopback functions (depicted in Figure 9-13).
相關(guān)PDF資料
PDF描述
DS34T102GN+ IC TDM OVER PACKET 484TEBGA
DS3501U+H IC POT NV 128POS HV 10-USOP
DS3502U+ IC POT DGTL NV 128TAP 10-MSOP
DS3503U+ IC POT DGTL NV 128TAP 10-MSOP
DS3897MX IC TXRX BTL TRAPEZIODAL 20-SOIC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS34S132GN+ 功能描述:通信集成電路 - 若干 32Port TDM-Over-Pack Transport Device RoHS:否 制造商:Maxim Integrated 類型:Transport Devices 封裝 / 箱體:TECSBGA-256 數(shù)據(jù)速率:100 Mbps 電源電壓-最大:1.89 V, 3.465 V 電源電壓-最小:1.71 V, 3.135 V 電源電流:50 mA, 225 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Tube
DS34S132GNA2+ 功能描述:通信集成電路 - 若干 32Port TDM-Over-Pack Transport Device RoHS:否 制造商:Maxim Integrated 類型:Transport Devices 封裝 / 箱體:TECSBGA-256 數(shù)據(jù)速率:100 Mbps 電源電壓-最大:1.89 V, 3.465 V 電源電壓-最小:1.71 V, 3.135 V 電源電流:50 mA, 225 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Tube
DS34T101 制造商:MAXIM 制造商全稱:Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip
DS34T101_08 制造商:MAXIM 制造商全稱:Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip
DS34T101_09 制造商:MAXIM 制造商全稱:Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip