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參數(shù)資料
| 型號： | CYP15G0402DXB |
| 廠商： | Cypress Semiconductor Corp. |
| 英文描述： | Quad HOTLink II SERDES(四HOTLink II并行轉(zhuǎn)換器) |
| 中文描述： | 二，四的HOTLink SERDES的（四的HOTLink二并行轉(zhuǎn)換器） |
| 文件頁數(shù)： | 28/29頁 |
| 文件大?。?/td> | 634K |
| 代理商： | CYP15G0402DXB |
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CYP15G0402DXB
CYV15G0402DXB
Document #: 38-02057 Rev. *G
Cypress Semiconductor Corporation, 2004. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
Page 28 of 29
Ordering Information
Package Diagram
HOTLink is a registered trademark, and HOTLink II and MultiFrame are trademarks, of Cypress Semiconductor Corporation.
ESCON is a registered trademark of International Business Machines. All product and company names mentioned in this document
are the trademarks of their respective holders.
Speed
Standard
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Ordering Code
CYP15G0402DXB-BGC
CYP15G0402DXB-BGI
CYV15G0402DXB-BGC
CYV15G0402DXB-BGI
CYP15G0402DXB-BGXC
CYP15G0402DXB-BGXI
CYV15G0402DXB-BGXC
CYV15G0402DXB-BGXI
Package
Name
BL256
BL256
BL256
BL256
BL256
BL256
BL256
BL256
Package Type
Operating
Range
Commercial
Industrial
Commercial
Industrial
Commercial
Industrial
Commercial
Industrial
256-ball Thermally Enhanced Ball Grid Array
256-ball Thermally Enhanced Ball Grid Array
256-ball Thermally Enhanced Ball Grid Array
256-ball Thermally Enhanced Ball Grid Array
Pb-Free 256-ball Thermally Enhanced Ball Grid Array
Pb-Free 256-ball Thermally Enhanced Ball Grid Array
Pb-Free 256-ball Thermally Enhanced Ball Grid Array
Pb-Free 256-ball Thermally Enhanced Ball Grid Array
256-lead L2 Ball Grid Array (27 x 27 x 1.57 mm) BL256
51-85123-*E
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| CYV15G0402DXB | Quad HOTLink II SERDES(四HOTLink II并行轉(zhuǎn)換器) |
| CYP15G0403DXB | Independent Clock Quad HOTLink II Transceiver(獨立時鐘，四熱連接II收發(fā)器) |
| CYV15G0403DXB | Independent Clock Quad HOTLink II Transceiver(獨立時鐘，四熱連接II收發(fā)器) |
| CYW15G0403DXB | Independent Clock Quad HOTLink II Transceiver(獨立時鐘，四熱連接II收發(fā)器) |
| CYRF69103 | Programmable Radio on Chip Low Power |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CYP15G0402DXB-BGC | 功能描述:電信線路管理 IC Quad Channel SERDES COM RoHS:否 制造商:STMicroelectronics 產(chǎn)品:PHY 接口類型:UART 電源電壓-最大:18 V 電源電壓-最小:8 V 電源電流:30 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VFQFPN-48 封裝:Tray |
| CYP15G0402DXB-BGI | 制造商:Cypress Semiconductor 功能描述: |
| CYP15G0402DXB-BGXC | 功能描述:電信線路管理 IC Quad Ch HOTLink II GbE 1XFC SERDES RoHS:否 制造商:STMicroelectronics 產(chǎn)品:PHY 接口類型:UART 電源電壓-最大:18 V 電源電壓-最小:8 V 電源電流:30 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VFQFPN-48 封裝:Tray |
| CYP15G0402DXB-BGXI | 制造商:CYPRESS 制造商全稱:Cypress Semiconductor 功能描述:Quad HOTLink II⑩ SERDES |
| CYP15G0402DX-BGC | 制造商:CYPRESS 制造商全稱:Cypress Semiconductor 功能描述:Quad HOTLinkII SERDES |
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