參數(shù)資料
型號(hào)： CY7C68001
廠商： Cypress Semiconductor Corp.
元件分類： 基準(zhǔn)電壓源/電流源
英文描述： EZ-USB FX2 USB Microcontroller High-Speed USB Peripheral Controller
中文描述： EZ - USB FX2的USB微控制器的高速USB外設(shè)控制器
文件頁數(shù)： 38/42頁
文件大?。?/td> 1588K
代理商： CY7C68001
CY7C68001
Document #: 38-08013 Rev. *H
Page 38 of 42
from the thermal pad to the PCB inner ground plane by a 5 x
5 array of via. A via is a plated through hole in the PCB with a
finished diameter of 13 mil. The QFN’s metal die paddle must
be soldered to the PCB’s thermal pad. Solder mask is placed
on the board top side over each via to resist solder flow into
the via. The mask on the top side also minimizes outgassing
during the solder reflow process.
For further information on this package design please refer to
“Application Notes for Surface Mount Assembly of Amkor’s
Micro
LeadFrame (MLF) Packages.” This application note
can be downloaded from Amkor’s web site from the following
URL: http://www.amkor.com/products/notes_papers/MLFAp-
pNote.pdf. The application note provides detailed information
on board mounting guidelines, soldering flow, rework process,
etc.
Figure 14-1
below displays a cross-sectional area underneath
the package. The cross section is of only one via. The solder
paste template needs to be designed to allow at least 50%
solder coverage. The thickness of the solder paste template
should be 5 mil. It is recommended that “No Clean” type 3
solder paste is used for mounting the part. Nitrogen purge is
recommended during reflow.
Figure 14-2
a is a plot of the solder mask pattern and
Figure 14-2
b displays an X-Ray image of the assembly
(darker areas indicate solder.
Note:
15. Source for recommendations:
High-Speed USB Platform Design Guidelines
, http://www.usb.org/developers/data/hs_usb_pdg_r1_0.pdf.
0.017” dia
Solder Mask
Cu Fill
Cu Fill
PCB Material
PCB Material
0.013” dia
Via hole for thermally connecting the
QFN to the circuit board ground plane.
This figure only shows the top three layers of the
circuit board: Top Solder, PCB Dielectric, and the Ground Plane.
Figure 14-1. Cross section of the Area Underneath the QFN Package
Figure 14-2. (a) Plot of the Solder Mask (White Area)
Figure 0-2. (b) X-ray Image of the Assembly
相關(guān)PDF資料
PDF描述
CY7C68013 Universal Serial Bus Microcontroller(EZ-USB FX2 USB 高速USB外圍微控制器)
CY7C68015A EZ-USB FX2LP USB Microcontroller
CY7C68013A-100AXC Hook-Up Wire; Conductor Size AWG:26; No. Strands x Strand Size:7 x 34; Jacket Color:Purple; Approval Bodies:UL, CSA; Approval Categories:UL AWM Styles 1007, 1565; CSA Types TR-64, TRSR-64; JQA-F; Passes VW-1 Flame Test RoHS Compliant: Yes
CY7C68014A-100AXC Light Pipe; Mounting Hole Dia:3.5mm; Material:Polycarbonate; Length:10.2mm; Color:Clear; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes RoHS Compliant: Yes
CY7C68014A-128AXC Light Pipe; Mounting Hole Dia:3.5mm; Material:Polycarbonate; Length:11.4mm; Color:Clear; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes RoHS Compliant: Yes
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C68001-56LFXC 功能描述:輸入/輸出控制器接口集成電路 8/16 Bit Datapath LO COM RoHS:否 制造商:Silicon Labs 產(chǎn)品: 輸入/輸出端數(shù)量: 工作電源電壓: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-64 封裝:Tray
CY7C68001-56LTXC 功能描述:USB 接口集成電路 USB HS Controller RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
CY7C68001-56LTXCKG 制造商:Rochester Electronics LLC 功能描述: 制造商:Cypress Semiconductor 功能描述:
CY7C68001-56PVCT 制造商:Cypress Semiconductor 功能描述:High Speed USB Interface Device 56-Pin SSOP T/R
CY7C68001-56PVXC 功能描述:USB 接口集成電路 8/16 Bit Datapath LO COM RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
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