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| 型號(hào)： | BX80528KL150GD |
| 廠商： | INTEL CORP |
| 元件分類(lèi)： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 1500 MHz, MICROPROCESSOR, CPGA603 |
| 封裝： | PGA-603 |
| 文件頁(yè)數(shù)： | 11/116頁(yè) |
| 文件大?。?/td> | 2277K |
| 代理商： | BX80528KL150GD |
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Intel XeonTM Processor MP
108
Datasheet
8.2
Mechanical Specifications
This section documents the mechanical specifications of the boxed processor passive heatsink.
Proper clearance is required around the heatsink to ensure proper installation of the processor and
unimpeded airflow for proper cooling.
8.2.1
Boxed Processor Heatsink Dimensions
The boxed processor is shipped with an unattached passive heatsink. Clearance is required around
the heatsink to ensure unimpeded airflow for proper cooling. The physical space requirements and
dimensions for the boxed processor with assembled heatsink are shown in Figure 38 (Multiple
Views). The airflow requirements for the boxed processor heatsink must also be taken into
consideration when designing new system boards and chassis. The airflow requirements are
detailed in the Thermal Specifications, Section 8.3.1.
8.2.2
Boxed Processor Heatsink Weight
The boxed processor heatsink weighs no more than 410 grams. See Chapter 4.0 and Chapter 6.0 of
this document along with the
Intel
XeonTM Processor MP Family Thermal Design Guidelines for
details on the processor weight and heatsink requirements.
8.2.3
Boxed Processor Retention Mechanism and Heatsink Supports
The Intel Xeon processor MP will ship with a heatsink, retention mechanism, clips, screws and
thermal interface material. Integration instructions will also be included with the boxed processor.
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