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參數(shù)資料
| 型號(hào)： | BX80528KL150GD |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 1500 MHz, MICROPROCESSOR, CPGA603 |
| 封裝： | PGA-603 |
| 文件頁(yè)數(shù)： | 10/116頁(yè) |
| 文件大?。?/td> | 2277K |
| 代理商： | BX80528KL150GD |
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Intel XeonTM Processor MP
Datasheet
107
8.0
Boxed Processor Specifications
8.1
Introduction
The Intel
Xeon processor MP is also offered as an Intel boxed processors. Intel boxed
processors are intended for system integrators who build systems from components available
through distribution channels. The MP version of the boxed Intel Xeon processor is supplied with
an unattached passive heatsink. Intel boxed processors do not include voltage regulation modules
(VRMs). Integrators should contact their board supplier to receive a list of supported module
vendors and models.
This chapter documents system board and platform requirements for the cooling solution that is
supplied with the boxed processor. This chapter is particularly important for OEM's that
manufacture system boards and chassis for integrators. Figure 37 shows a mechanical
representation of a boxed processor heatsink.
Note:
Drawings in this section reflect only the specifications on the Intel boxed processor product. These
dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system
designer's responsibility to consider their proprietary cooling solution when designing to the
required keep-out zone on their system platform and chassis.
Figure 37. Mechanical Representation of the Boxed MP Processor Passive Heatsink
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