參數(shù)資料
型號: BX80528KL150GD
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 1500 MHz, MICROPROCESSOR, CPGA603
封裝: PGA-603
文件頁數(shù): 104/116頁
文件大?。?/td> 2277K
代理商: BX80528KL150GD
Intel XeonTM Processor MP
88
Datasheet
6.0
Thermal Specifications
This chapter provides the general data used for designing a thermal solution for Intel XeonTM MP
processors. However, for the correct thermal measuring processes, refer to the
Intel
XeonTM
Processor MP Family Thermal Design Guidelines or the Intel XeonTM Processor Thermal Design
Guidelines. The processor utilizes a integrated heat spreader (IHS) for heatsink attachment which
is intended to provide for multiple types of thermal solutions, thus thermal specifications are with
reference to T
CASE (the IHS). See Figure 33 for an exploded view of the processor package and
thermal solution assembly.
Note:
The processor is either shipped alone or with a heatsink (boxed processor only). All other
components shown in Figure 33 must be purchased separately.
Note:
This is a graphical representation. For specifications, see each component’s respective
documentation listed in Section 1.2.
Figure 33. Processor with Thermal and Mechanical Components - Exploded View
EMI ground
frame
Heat sink clip
Heat sink
Retention
mechanism
603-pin
socket
EMI ground
frame
Heat sink clip
Heat sink
Retention
mechanism
603-pin
socket
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