參數(shù)資料
型號: AD9549ABCPZ
廠商: Analog Devices Inc
文件頁數(shù): 36/76頁
文件大小: 0K
描述: IC CLOCK GEN/SYNCHRONIZR 64LFCSP
產(chǎn)品變化通告: AD9549A Mask Change 22/Oct/2010
標(biāo)準(zhǔn)包裝: 1
類型: 時鐘/頻率發(fā)生器,同步器
PLL:
主要目的: 以太網(wǎng),SONET/SDH,Stratum
輸入: CMOS,LVDS,LVPECL
輸出: CMOS,HSTL
電路數(shù): 1
比率 - 輸入:輸出: 2:2
差分 - 輸入:輸出: 是/是
頻率 - 最大: 750MHz
電源電壓: 1.71 V ~ 3.465 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 64-VFQFN 裸露焊盤,CSP
供應(yīng)商設(shè)備封裝: 64-LFCSP-VQ(9x9)
包裝: 托盤
產(chǎn)品目錄頁面: 776 (CN2011-ZH PDF)
AD9549
Rev. D | Page 41 of 76
THERMAL PERFORMANCE
Table 9. Thermal Parameters
Symbol
Thermal Characteristic Using a JEDEC51-7 Plus JEDEC51-5 2S2P Test Board
Value
Unit
θ
JA
Junction-to-ambient thermal resistance, 0.0 m/sec air flow per JEDEC JESD51-2 (still air)
25.2
°C/W
θ
JMA
Junction-to-ambient thermal resistance, 1.0 m/sec air flow per JEDEC JESD51-6 (moving air)
22.0
°C/W
θ
JMA
Junction-to-ambient thermal resistance, 2.0 m/sec air flow per JEDEC JESD51-6 (moving air)
19.8
°C/W
θ
JB
Junction-to-board thermal resistance, 1.0 m/sec air flow per JEDEC JESD51-8 (moving air)
13.9
°C/W
θ
JC
Junction-to-case thermal resistance (die-to-heat sink) per MIL-Std 883, Method 1012.1
1.7
°C/W
Ψ
JT
Junction-to-top-of-package characterization parameter, 0 m/sec air flow per JEDEC JESD51-2 (still air)
0.1
°C/W
The AD9549 is specified for a case temperature (TCASE). To ensure
that TCASE is not exceeded, an airflow source can be used.
Use the following equation to determine the junction tempera-
ture on the application PCB:
TJ = TCASE + (ΨJT × PD)
where:
TJ is the junction temperature (°C).
TCASE is the case temperature (°C) measured by customer at top
center of package.
ΨJT is the value from Table 9.
PD is the power dissipation (see the Total Power Dissipation
parameter in the Specifications section).
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first-order
approximation of TJ by the equation
TJ = TA + (θJA × PD)
where TA is the ambient temperature (°C).
Values of θJC are provided for package comparison and PCB
design considerations when an external heat sink is required.
Values of θJB are provided for package comparison and PCB
design considerations.
The values in Table 9 apply to both 64-lead package options.
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